| Allicdata Part #: | HM2P66PDK3E5N9LF-ND |
| Manufacturer Part#: |
HM2P66PDK3E5N9LF |
| Price: | $ 1.11 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Amphenol FCI |
| Short Description: | MPAC 5R ST PF HDR |
| More Detail: | 128 (110 + 18 Ground) Position Header, Male Pins C... |
| DataSheet: | HM2P66PDK3E5N9LF Datasheet/PDF |
| Quantity: | 1000 |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| 1152 +: | $ 1.01289 |
| Series: | Millipacs® |
| Packaging: | Tray |
| Lead Free Status / RoHS Status: | -- |
| Part Status: | Active |
| Moisture Sensitivity Level (MSL): | -- |
| Connector Type: | Header, Male Pins |
| Connector Style: | AB 22 |
| Number of Positions: | 128 (110 + 18 Ground) |
| Number of Positions Loaded: | All |
| Pitch: | 0.079" (2.00mm) |
| Number of Rows: | 5 + 1 |
| Mounting Type: | Through Hole |
| Termination: | Press-Fit |
| Connector Usage: | -- |
| Contact Finish: | Gold |
| Contact Finish Thickness: | 30.0µin (0.76µm) |
| Current Rating: | 1.5A |
| Voltage Rating: | 750Vrms |
| Operating Temperature: | -55°C ~ 125°C |
| Features: | -- |
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Backplane connectors are a critical component in most electronic systems, as they provide a physical connection between electromagnetic components in order to ensure reliable and efficient communication. For ease and speed of data transfer, they need to employ the latest and most efficient technologies. The HM2P66PDK3E5N9LF from the Hard Metric family of backplane connectors satisfies these requirements while also providing a high degree of versatility.
The HM2P66PDK3E5N9LF is a high-performance connector that offers a variety of advantages over other backplane connectors. Its small form factor and low profile facilitate system integration, while its 0.5 mm pitch and high-speed data transmission provide enhanced performance. Its miniature size, along with its robust design, further plant its status as a reliable and fully compatible connector.
Aside from its performance-related features, the HM2P66PDK3E5N9LF also possesses several other attributes that make it an excellent choice for backplane connectors. Its compact design allows for a high packing density, which simplifies component installation and reduces material costs. It also features a curved body design with self-guide clips for easy installation and removal from mating equipment. Its high mating durability and its ability to withstand multiple mating cycles are also commendable.
The HM2P66PDK3E5N9LF is the ideal choice for use in a wide range of applications. These include data transmission and reception, mobile use, industrial automation, signal processing, high-speed data rates, and high-density interface applications. Its flexibility means it can provide secure connections between backplane and board assemblies.
The working principle of the HM2P66PDK3E5N9LF is similar to that of other backplane connectors. It has a series of pins arranged in a pre-defined pattern, and these pins are connected to either the card or the backplane via spring-loaded mechanisms. When the pins are inserted into the socket, they create a secure connection that can withstand high data transfer rates. This secure connection allows for efficient data communication between two components.
The HM2P66PDK3E5N9LF is a well-engineered and reliable backplane connector suitable for a wide range of applications. Its compact design and high-speed data transmission capabilities make it an ideal choice for those seeking a reliable and cost-effective solution. It is also compatible with many standard backplane connectors, making it a multi-functional and capable choice for providing secure and dependable communication between components.
The specific data is subject to PDF, and the above content is for reference
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HM2P66PDK3E5N9LF Datasheet/PDF