HM2P65PDK3Y1N9LF Allicdata Electronics
Allicdata Part #:

HM2P65PDK3Y1N9LF-ND

Manufacturer Part#:

HM2P65PDK3Y1N9LF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: MPAC 5R ST PF HDR
More Detail: 169 (125 + 44 Ground) Position Header, Male Pins C...
DataSheet: HM2P65PDK3Y1N9LF datasheetHM2P65PDK3Y1N9LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Millipacs®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: AB 25
Number of Positions: 169 (125 + 44 Ground)
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5 + 2
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 750Vrms
Operating Temperature: -55°C ~ 125°C
Features: --
Description

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Backplane connectors are used for high speed data signal transmission in computer and communication applications. HM2P65PDK3Y1N9LF is one type of backplane connectors which is called hard metric. It is a type of threadless, snap-in connector.

The HM2P65PDK3Y1N9LF is mainly used in computer applications. Its features make it suitable for a variety of high-speed I/O designs and offer design flexibility. This connector also provides a cost effective alternative to traditional high-density bus connectors.

The hard metric connector comes in two configurations: Standard (ST) and Compact (CT). The ST configuration has a large enough number of pins to support up to 127 differential and tristate signals, while the CT configuration has enough pins to support up to 63 differential and tristate signals. The HM2P65PDK3Y1N9LF provides an excellent solution for high-speed I/O designs in general purpose, industrial, and telecommunications equipment.

The working principle of the HM2P65PDK3Y1N9LF is quite simple. Each of the contacts within the connector has two layers, an inner and an outer. The inner layer is conductive and contacts the I/O pads on the printed circuit board. The outer layer acts as a shield and ensures that the contact is properly secured against unwanted vibrations and shocks. This ensures that the communication between the I/O pads and the backplane connector remains stable and secure.

The HM2P65PDK3Y1N9LF also has a separate, dedicated ground pin which is used to provide ground connections for the high-speed signals. This helps ensure that the electrical signal is properly grounded before it is transmitted from one end of the bus to the other.

The HM2P65PDK3Y1N9LF is a robust, reliable, and versatile backplane connector. It is ideal for use in applications that require high-speed data transmission and need reliable signal integrity and performance. Its features, coupled with its robust construction, make it a great choice for high-speed I/O designs.

The specific data is subject to PDF, and the above content is for reference

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