![HM2P65PZL361N9 Allicdata Electronics](https://files.allicdata.com/upload/common/default.jpg)
Allicdata Part #: | HM2P65PZL361N9-ND |
Manufacturer Part#: |
HM2P65PZL361N9 |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | MPAC 5R ST PF HDR |
More Detail: | Position Connector |
DataSheet: | ![]() |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1 +: | 0.00000 |
Series: | Millipacs® |
Packaging: | -- |
Lead Free Status / RoHS Status: | -- |
Part Status: | Obsolete |
Moisture Sensitivity Level (MSL): | -- |
Connector Type: | -- |
Connector Style: | -- |
Number of Positions: | -- |
Number of Positions Loaded: | -- |
Pitch: | -- |
Number of Rows: | -- |
Mounting Type: | -- |
Termination: | -- |
Connector Usage: | -- |
Contact Finish: | -- |
Contact Finish Thickness: | -- |
Voltage Rating: | -- |
Operating Temperature: | -- |
Features: | -- |
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Backplane connectors are connectors used to transmit signals between different subsystems on printed circuit boards or between printed circuit boards and other electronic components. Backplane connectors are divided into different categories based on the electronic characteristics of the signal they transmit, which are generally referred to as Hard Metric, Standard, and High Speed. One of the most common backplane connectors in the Hard Metric category is the HM2P65PZL361N9 Connector.
The HM2P65PZL361N9 backplane connector from Amphenol is designed for a current environment which typically sees power levels up to 3 Amps per signal contact, and a high density of up to 65 signal contacts. It is recommended for use in high-speed applications up to 5GHz. The HM2P65PZL361N9 connector is also compatible with multiple design standards, including the PICMG® 3.0 Hard Metric I/O base specification.
The design of the HM2P65PZL361N9 is such that it allows for a very small footprint on the backplane and a high density of signal contacts, allowing it to be used as an efficient interconnect solution for high-speed applications and the highest power requirements. The contact plating of the HM2P65PZL361N9 is designed to ensure reliable signal integrity with low insertion loss and high return loss. The connector is also designed with low crosstalk and EMI performance. It has a high vibration resistance and high shock resistance.
Due to its high-speed and high-power capabilities as well as its small footprint, the HM2P65PZL361N9 is a great choice for applications such as high-performance Servers, Motherboards, Storage and Networking cards, and other communications applications. Its high-speed, high-density, and high-power capabilities make it an ideal solution for interconnects between high-speed devices or between high-end devices.
The working principle of the HM2P65PZL361N9 backplane connector relies on the use of a metal insert or shell that is located in the backplane. The shell contains a signal or power source that is connected to the metal insert and the metal insert is then inserted into the body of the backplane. Once the metal insert is in place, the signal or power will be transmitted to different subsystems on the backplane. Additionally, the connector is designed to provide EMI protection and the pins are tin plated to provide a contact surface with a high level of conductivity.
The HM2P65PZL361N9 connector from Amphenol is a great choice for high-speed and high-power applications. Its design and features make it capable of providing reliable and consistent signal and power transmission, while its small size allows for its use in a variety of applications. It is also designed to provide EMI protection and a superior contact surface for reliable connections. As a result, it is an excellent choice for connecting high-speed devices or between high-end devices.
The specific data is subject to PDF, and the above content is for reference
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