Allicdata Part #: | 294-1088-ND |
Manufacturer Part#: |
HP1-TO3-CB |
Price: | $ 0.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK PWR .90"H BLACK TO-3 |
More Detail: | Heat Sink TO-3 Aluminum Board Level |
DataSheet: | HP1-TO3-CB Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | HP1 |
Part Status: | Obsolete |
Type: | Board Level |
Package Cooled: | TO-3 |
Attachment Method: | Bolt On |
Shape: | Square, Pin Fins |
Length: | 2.500" (63.50mm) |
Width: | 2.500" (63.50mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.900" (22.86mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 5.40°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Heat sinks are an important tool in the management of large-scale thermal systems. Whether air-cooled or water-cooled, these systems require efficient heat sink designs for effective cooling. The HP1-TO3-CB is a leading example of heat sink technology in use today.
The HP1-TO3-CB is a combination of a high performance heat sink with an integrated thermal control system. The thermal control system is designed to provide a comprehensive solution for over-temperature protection and high heat production. The combination of the high performance thermal design and the thermal control system make the HP1-TO3-CB an ideal solution for thermal management applications.
The HP1-TO3-CB can be used in a variety of applications, including PC gaming, server racks, and data processing. It is capable of providing high-performance cooling within a small form factor. The thermal design allows for efficient heat transfer, while the integrated thermal control system helps protect the system from over-temperature conditions.
The HP1-TO3-CB incorporates a unique design that combines a high-performance heat sink with an integrated thermal control system. The heat sink is designed for maximum heat transfer, featuring fins surrounded by a baseplate to increase the surface area for heat dissipation. The baseplate is also designed to enable effective air flow. The thermal control system helps to maintain an acceptable temperature level by shutting off the system when temperature exceeding pre-defined thresholds is detected.
The HP1-TO3-CB has a wide range of benefits for users. It offers high performance capabilities for thermal management and thermal protection, as well as low cost of ownership for large-scale applications. It can also be used in smaller form factors, making it a great option for applications where space is limited.
The HP1-TO3-CB is an ideal solution for applications where thermal management and/or thermal protection are needed. Its advanced design allows for efficient heat transfer, while the integrated thermal control system helps protect the system from temperature extremes. The combination of these features makes the HP1-TO3-CB an excellent choice for users looking for a reliable and efficient solution for thermal management.
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