HP3-TO3-CB

Series:	HP3
Part Status:	Obsolete
Type:	Board Level
Package Cooled:	TO-3
Attachment Method:	Bolt On
Shape:	Square, Pin Fins
Length:	3.120" (79.25mm)
Width:	3.120" (79.25mm)
Diameter:	--
Height Off Base (Height of Fin):	1.000" (25.40mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	4.40°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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< div style="font-size: 14px; font-family: "Times New Roman"; line-Height: 1.5; text-align: justify; font-variant: normal;">Thermal - Heat Sinks are widely used in various industries today. These are components that use heat transfer processes to dissipate the heat generated from various sources of energy and power sources in order to keep them functioning optimally. HP3-TO3-CB application field and working principle are two such thermal-heat sink technologies that are commonly used by many industries.The HP3-TO3-CB application field is well-known for its ability to dissipate large quantities of energy from electronic components or processors. This dissipated energy is then used to cool the components in the device, preventing them from overheating. The HP3-TO3-CB application field is also capable of providing a high level of protection against electrical and electromagnetic interference. This makes the HP3-TO3-CB application field a popular choice for many applications, including but not limited to secure cloud computing, medical data storage, and aerospace components.The working principle of the HP3-TO3-CB heat sink technology involves using a vacuum between the heating element and the substrate in order to draw heat away from the device. As the heat is drawn away from the substrate, it is conducted away to the surfaces of the heat sink. This dissipated heat energy is then used to cool down the components or processors in the device.The HP3-TO3-CB thermal-heat sink technology provides high-efficiency operation as well as low power dissipation. It is highly energy-efficient and can provide a great return on investment. This technology also ensures long-lasting reliability and durability by dissipating the heat quickly and evenly. Additionally, it is highly effective in preventing the buildup of dust, dirt and other particles that can clog the system and affect the performance. Another advantage of the HP3-TO3-CB thermal-heat sink technology is that it does not require any additional power to provide its cooling benefits. This makes it an extremely efficient and cost-effective choice for many applications. The technology is also highly durable and can handle a wide range of temperatures and is capable of providing a high level of protection.Overall, the HP3-TO3-CB thermal-heat sink technology is an extremely efficient and cost-effective way to provide cooling and protection for electronic components and processors. Its ability to dissipate large amounts of energy quickly and evenly, combined with its ability to provide a high level of protection, make it an ideal choice for many applications.