HSE-B1711-057 Allicdata Electronics
Allicdata Part #:

HSE-B1711-057-ND

Manufacturer Part#:

HSE-B1711-057

Price: $ 0.20
Product Category:

Fans, Thermal Management

Manufacturer: CUI Inc.
Short Description: HEAT SINK, EXTRUSION, TO-220, 25
More Detail: Heat Sink TO-220 Aluminum Alloy 3.1W @ 75°C Board ...
DataSheet: HSE-B1711-057 datasheetHSE-B1711-057 Datasheet/PDF
Quantity: 1000
2500 +: $ 0.17357
Stock 1000Can Ship Immediately
$ 0.2
Specifications
Series: HSE
Part Status: Active
Type: Board Level
Package Cooled: TO-220
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: 0.984" (25.00mm)
Width: 0.625" (16.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.354" (9.00mm)
Power Dissipation @ Temperature Rise: 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.07°C/W @ 200 LFM
Thermal Resistance @ Natural: 24.19°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermals - Heat Sinks provide a variety of technological advantages to any sectors that use them. One of them is the HSE-B1711-057, which is equipped with the mechanical and electrical properties that many industries require for the utmost efficiency. The warm, dry overall environment provided by the HSE-B1711-057 creates an ideal environment for the efficient operation and consequent cost savings.

The HSE-B1711-057 is designed to dissipate heat from electrical components in high power electronics. It is constructed with multiple mounting holes and integrated heat sink bases, and its natural room temperature range is from –20°C to +100°C. This heat sink has a special anodized aluminum design that conforms to the JEDEC standard, which allows excellent thermal performance. It also features an anti-oxidizing powder coat that further prevents oxidation.

As the name implies, the HSE-B1711-057 works by transferring the excess heat from the electrical components to the environment, maintaining the device at a safe and normal temperature. The process of heat dissipation is known as a heat sink, and the main method to achieve this in the context of the HSE-B1711-057 is through convection. It extracts the excess heat generated from the electric components and radiates it through radiators, which in turn spread it in the environment.

The radiator design and orientation of the HSE-B1711-057 are specifically designed to be effective in a broad range of environments. Its form factor allows it to easily fit within tight spaces and also to mount on vertical surfaces. Additionally, eight removable pins for flexible mounting locations can be tooled for any purpose, such as sidewall installations or multiple radiator lines, as well as direct mounting on the floor.

Coupled with a robust construction, the superior thermal performance of the HSE-B1711-057 ensures its dependability and longevity. It is equipped with space-saving features and is compliant with the European Union RoHS regulations, making it the ideal addition to any industrial setting. Furthermore, to ensure that the safety of the premises is never compromised, the HSE-B1711-057 has been designed to keep electrical current levels low, ensuring that operators and other personnel remain safe in their environment.

The HSE-B1711-057 application field consists of a wide range of commercial and industrial applications, where the technology serves crucial roles. Examples of some applications include telecommunications, medical electronics, industrial automation, military and aerospace, commercial vehicles, synthetic vision systems, rail systems, renewable energy, and components of industrial and professional audio-video systems.

Finally, the device is designed to meet the most challenging demands required by cutting-edge industries while simultaneously remaining eco-friendly. The superior design of the HSE-B1711-057 allows it to be used for many generations, making it an excellent part of any industrial system.

The specific data is subject to PDF, and the above content is for reference

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