| Allicdata Part #: | 102-4231-ND |
| Manufacturer Part#: |
HSE-B18254-0396H |
| Price: | $ 0.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEAT SINK, EXTRUSION,TO-218, 25. |
| More Detail: | Heat Sink TO-218 Aluminum Alloy 8.2W @ 75°C Board ... |
| DataSheet: |  HSE-B18254-0396H Datasheet/PDF |
| Quantity: | 589 |
| 1 +: | $ 0.79380 |
| 10 +: | $ 0.75411 |
| 25 +: | $ 0.73433 |
| 50 +: | $ 0.71442 |
| 100 +: | $ 0.67473 |
| 250 +: | $ 0.63504 |
| 500 +: | $ 0.59535 |
| 1000 +: | $ 0.55566 |
| 5000 +: | $ 0.53582 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.000" (25.40mm) |
| Width: | 1.654" (42.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | 8.2W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 2.29°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 9.15°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
| Series: | HSE |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-218 |
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Heat sinks are thermal management tools that are designed to transfer heat away from heat sources, such as semiconductor components, by dissipating the heat into ambient or flowing air or fluids. The HSE-B18254-0396H is a type of heat sink designed for use in a wide range of applications. It can be used in a variety of cooling applications, such as computers, consumer electronics, audio equipment, automotive electronics, communications systems, and even medical imaging.
The HSE-B18254-0396H has a fin surface area of 2,800mm², which provides excellent thermal performance. It is constructed from aluminum with a black anodized finish that helps protect the surface from corrosion and wear. The heat sink consists of two upper and lower fins, which are separated by a gap of 3.6mm to ensure adequate airflow. Additionally, the HSE-B18254-0396H has a PVA coating which increases its heat conductivity and helps wick away any heat that is generated by the components that it is used with. The heat sink also has two mounting holes which make installation easy.
The HSE-B18254-0396H relies on air or liquid cooling to dissipate heat away from the component it is attached to. Heat is drawn away from the component through the two upper and lower fins of the HSE-B18254-0396H. The fins are designed to facilitate the transfer of thermal energy, and their design creates a strong “convection effect” which helps to draw air or liquid away from the component. This allows the heat to spread across the entire surface area of the HSE-B18254-0396H, and dissipate quickly and efficiently. This helps to keep the component at a safe, and optimal operating temperature.
The HSE-B18254-0396H is often used in electronic applications that require a high degree of thermal conductivity, such as Graphics Processing Units (GPUs), Central Processing Units (CPUs), or power amplifiers. It is also used in medical-imaging equipment, as it helps to ensure vital components such as the X-ray source, detector, and imaging tube remain at a safe temperature. The HSE-B18254-0396H is also popular for cooling consumer electronics such as LCD televisions, gaming consoles, and speakers. Its efficiency, durability, design, and affordability make it an attractive choice for many thermal management projects.
The HSE-B18254-0396H is an efficient, dependable, and affordable heat sink that can be used in a variety of thermal management projects. Its fin surface area, design, and mounting holes make it a great choice for cooling CPUs, GPUs, and power amplifiers in computers, and for cooling imaging components in medical imaging equipment. The HSE-B18254-0396H is also a popular choice for cooling consumer electronics such as televisions, game consoles, and speakers.
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