| Allicdata Part #: | HSE-B18317-035H-01-ND |
| Manufacturer Part#: |
HSE-B18317-035H-01 |
| Price: | $ 0.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEAT SINK, EXTRUSION, TO-218, 31 |
| More Detail: | Heat Sink TO-218 Aluminum Alloy 10.0W @ 75°C Board... |
| DataSheet: |  HSE-B18317-035H-01 Datasheet/PDF |
| Quantity: | 1000 |
| 1500 +: | $ 0.60858 |
| Series: | HSE |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-218 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.250" (31.75mm) |
| Width: | 1.638" (41.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | 10.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 4.33°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 7.50°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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Thermal management is essential in order to ensure proper functionality and longevity in electronic components. Heat sinks are designed to absorb heat generated by electronic components and dissipate it in the form of radiation, convection or conduction. The HSE-B18317-035H-01 thermal heat sink is designed to provide thermal management in a wide range of applications.
The HSE-B18317-035H-01 heat sink is composed of a copper cold plate, a heat pipe array, and aluminum fins. The copper cold plate offers excellent thermal conductivity to absorb heat generated from electronic components, while the heat pipe array increases the heat sink surface area for improved cooling. The aluminum fins of the heat sink further increase the surface area, allowing the heat generated from the electronic components to be dissipated efficiently.
The HSE-B18317-035H-01 heat sink is designed for use in applications such as servers, storage arrays, and industrial control systems. The heat sink can be used to cool components in these applications such as CPUs, GPUs, and memory modules. The heat sink can also be used to cool components in consumer electronics such as PCs, gaming consoles, and smartphones. It can also be used to cool components in medical equipment and automation systems. In each of these applications, the heat generated from the electronic components is absorbed and dissipated away from the components, keeping them cool and running at optimal performance.
The working principle of the HSE-B18317-035H-01 heat sink is based on the use of thermal conduction. Heat generated from electronic components is absorbed by the copper cold plate and transferred to the heat pipe array and aluminum fins. The fins are designed to increase the surface area of the heat sink, allowing for better heat dissipation. As the fins dissipate the heat, the components are kept cool, resulting in improved performance and reliability.
In summary, the HSE-B18317-035H-01 thermal heat sink is designed for use in a wide range of applications to provide effective thermal management by absorbing and dissipating heat generated by electronic components. The heat sink is composed of a copper cold plate, heat pipe array, and aluminum fins to ensure efficient heat transfer and dissipation. The heat sink can be used to cool components in servers, storage arrays, and industrial control systems, as well as consumer electronics, medical equipment, and automation systems. The working principle of the HSE-B18317-035H-01 thermal heat sink is based on thermal conduction, which allows for effective heat dissipation and improved performance and reliability of electronic components.
The specific data is subject to PDF, and the above content is for reference