HSE-B18317-035H

Series:	HSE
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-218
Attachment Method:	PC Pin
Shape:	Rectangular, Fins
Length:	1.250" (31.75mm)
Width:	1.638" (41.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	9.8W @ 75°C
Thermal Resistance @ Forced Air Flow:	3.63°C/W @ 200 LFM
Thermal Resistance @ Natural:	7.65°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Thermal - Heat Sinks: HSE-B18317-035H Application Field and Working Principle

Heat sinks are typically devices used to dissipate heat from objects such as CPUs, GPUs, and other electronic components which generate high levels of heat during their operation. The most common type of a heat sink is typically composed of a metal plate or finned surface such as aluminum, copper, or steel, as well as a fan or other airflow-enhancing solution to help keep temperatures low.The HSE-B18317-035H heat sink is a highly efficient solution for cooling a variety of components that generate a significant amount of heat during their operation. It is designed specifically for use in servers, computers, and other consumer electronic products where temperature control can be critical to performance and reliability.The main advantage of the HSE-B18317-035H is its ability to offer superior cooling performance, even when compared to traditional heat sinks with fans. This is possible due to the combination of the heat sink’s specially designed fins, which have a larger surface area to disperse heat faster than a traditional fan-based solution, and its air-intake-channeled architecture, which ensures that the greatest amount of air passes through the fins for optimal cooling.The fins on the HSE-B18317-035H are also designed to eliminate dead air spaces and reduce turbulence, as well as to ensure that the air flow created by the fan optimally follows the fins to efficiently dissipate heat from the heat-generating component. Additionally, the HSE-B18317-035H features a low-profile design that makes it ideal for fitting into tight spaces, while also allowing for a greater level of heat dissipation when compared to its fan-based counterparts.The HSE-B18317-035H is also designed to be extremely efficient in its use of power. This makes it attractive for use in applications where efficient power utilization is a top priority, such as datacenters and other high-performance computing environments. Furthermore, it features a low-noise level that renders it ideal for use in discretely cooled systems like laptops or gaming PCs.In addition to its great performance and efficiency, the HSE-B18317-035H also provides superior stability, meaning it is able to maintain its performance in any given environment for an extended period of time without needing to be replaced. This makes it ideal for providing reliable cooling in crucial applications, such as in medical equipment or military systems.Overall, the HSE-B18317-035H heat sink is a reliable and efficient solution for dissipating the heat generated by a variety of electronic components. It features a low-profile design that is perfect for fitting into tighter spaces, as well as an efficient power-utilization rate that renders it suitable for high performance computing applications. Additionally, its superior stability ensures that it can remain operational in any given environment for an extended period of time without needing to be replaced.

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