HSE-B18318-0396H Allicdata Electronics
Allicdata Part #:

HSE-B18318-0396H-ND

Manufacturer Part#:

HSE-B18318-0396H

Price: $ 0.74
Product Category:

Fans, Thermal Management

Manufacturer: CUI Inc.
Short Description: HEAT SINK, EXTRUSION,TO-218, 31.
More Detail: Heat Sink TO-218 Aluminum Alloy 9.1W @ 75°C Board ...
DataSheet: HSE-B18318-0396H datasheetHSE-B18318-0396H Datasheet/PDF
Quantity: 1000
1350 +: $ 0.67032
Stock 1000Can Ship Immediately
$ 0.74
Specifications
Series: HSE
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-218
Attachment Method: PC Pin
Shape: Rectangular, Fins
Length: 1.250" (31.75mm)
Width: 1.654" (42.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: 9.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.57°C/W @ 200 LFM
Thermal Resistance @ Natural: 8.24°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

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Thermal - Heat Sink technology is a way of using heat sinks to dissipate the heat produced by electronic components. Heat Sinks are a type of passive heat transfer device, which use the thermal conductivity of materials to move heat away from a component, dissipating it into the air. The HSE-B18318-0396H thermal-heat sink is a product of active cooling system that makes use of thermoelectric materials to heat any surface it comes into contact with.

The HSE-B18318-0396H is a thermal-heat sink designed for use in computers and other electrical and electronic equipment. It is designed for use with air-cooled heat sinks, and it works by drawing air up through a metal base plate into the cooling fins. The air is heated by the heat generated by the components on the board, and then dissipated through the cooling fins. This allows the air to slow down and cool the components on the board, preventing them from overheating.

The HSE-B18318-0396H is made up of a combination of heat pipes, cooling fins and a metal plate. The heat pipes are designed to transfer heat from the internal components to the exterior of the board. The cooling fins help dissipate the heat from the pipes by spreading it across the board, while the metal plate acts as a barrier to keep the heat away from the components. The heat pipes are made of thermal-conductive materials such as copper or aluminum, and have a hollow interior that can be filled with air or a liquid cooling solution.

The HSE-B18318-0396H thermal-heat sink is designed for use in applications where space is a concern. The heat pipes are thin enough to fit on motherboards with limited real estate, and the cooling fins are designed to maximize air flow. The metal plate is also designed to protect the components from excessive heat, while still allowing the heat to dissipate. The HSE-B18318-0396H is an effective thermal-heat sink that can be used in a variety of applications, from commercial and medical electronics to gaming consoles, and more.

The HSE-B18318-0396H thermal-heat sink is also a great choice for applications that require energy-saving. As the metal plate prevents direct contact between the internal components and the cooling fins, it can reduce the amount of energy needed to cool the components. This helps to reduce power consumption and save money in the long run. The HSE-B18318-0396H is an efficient and cost-effective thermal-heat sink that can be used in a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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