Allicdata Part #: | HSE-B18381-035H-ND |
Manufacturer Part#: |
HSE-B18381-035H |
Price: | $ 0.61 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CUI Inc. |
Short Description: | HEAT SINK, EXTRUSION, TO-218, 38 |
More Detail: | Heat Sink TO-218 Aluminum Alloy 12.0W @ 75°C Board... |
DataSheet: | HSE-B18381-035H Datasheet/PDF |
Quantity: | 1000 |
1800 +: | $ 0.54684 |
Series: | HSE |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-218 |
Attachment Method: | PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.500" (38.10mm) |
Width: | 1.638" (41.60mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | 12.0W @ 75°C |
Thermal Resistance @ Forced Air Flow: | 3.52°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 6.25°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
.Thermal - Heat Sinks
Heat sinks are devices used to dissipate the heat from processor cores, integrated circuits, transistors, and other high power electronic components. They come in a variety of shapes, sizes and materials, and they can be mounted passively or actively. HSE-B18381-035H is a specific type of passively cooled, advanced heat sink designed for top performance in extreme operating environments.
The HSE-B18381-035H consists of a high performance, lightweight aluminum alloy structure. It features a unique, curved fin design optimized for maximum heat dissipation. The heat sink is highly reliable and has a long lasting cycle life, meaning it can last for decades under typical conditions. It also features a high-density passivation layer that helps to reduce corrosion and maximize heat dissipation. The fanless design makes it an ideal choice for mission-critical computer systems as it does not require any active maintenance or noise.
The working principle of the HSE-B18381-035H is based on thermodynamics, specifically the principles of convection and conduction. The finned structure of the heat sink allows air to pass freely over the surfaces, improving the rate of convection. At the same time, the metal alloy structure conducts heat away from the source, cooling the internal components. The combination of convection and conduction results in maximum efficiency and very little noise, making the heat sink a preferred choice for many industrial applications.
The HSE-B18381-035H is suitable for a wide range of applications, including industrial computers, telecommunication equipment, and mission-critical systems. Its core strength is its ability to dissipate high amounts of heat in extreme environments, making it an extremely reliable cooling option for sensitive electronics. The fanless design also helps to reduce the system’s noise profile, making it ideal for noise-sensitive applications. It is also designed to be compact and durable, making it suitable for applications where space and longevity are critical factors.
In conclusion, the HSE-B18381-035H is a highly efficient, lightweight, low-maintenance thermal-heat sink. Its fin design and heat dissipation capabilities can provide adequate cooling for most high powered electronic components in extreme environments. Its fanless design makes it a perfect choice for noise-sensitive applications as it does not require any maintenance and can last for many years. Therefore, the HSE-B18381-035H is an excellent choice for mission-critical applications in the industrial and telecommunications markets.
The specific data is subject to PDF, and the above content is for reference