HSE-B18635-035H-04

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are components designed to provide cooling for electronic devices such as processors and other components in electric circuits. The HSE-B18635-035H-04 is a type of thermal - Heat Sink that provides cooling to electronic components. The HSE-B18635-035H-04 has three main components including the base, the heat sink, and the fan. The base is designed to attach to the electronic devices providing a fixed center of support for the heat sink and fan components. The heat sink is fitted to the base and structured in a way to ensure that proper heat conduction from the device is achieved. The heat sink is made of a material that has good heat conducting properties like aluminum, copper, or other heat conducting materials. The fan component is then fit onto the heat sink and is designed to draw the heat away from the device. The fan is powered through a 12V power supply and is designed to deliver proper air flow to ensure proper cooling. The HSE-B18635-035H-04 Thermal - Heat Sinks consists of a fan and heat sink designed to provide cooling to electronic devices such as processors, which are devices that must be actively cooled due to their sensitive nature and tendency to heat up under work load. The HSE-B18635-035H-04 is designed with ground mounting features to ensure that the fan delivers the proper air flow and the heat sink efficiently transfers the heat away from the device. The ground mounting feature also ensures structural integrity and prevents damage from occurring. The HSE-B18635-035H-04 Thermal - Heat Sinks has a working temperature between 0°C and 70°C and can provide up to 800 LFM of air flow. The HSE-B18635-035H-04 is designed to be compatible with multiple board sizes including ATX, micro-ATX, mini-ATX, and nano-ITX. The HSE-B18635-035H-04 is also RoHS compliant and CE certified. The working principle behind the HSE-B18635-035H-04 thermal heat sink is based on the transfer of thermal energy from the hot component to the heat sink. The heat sink is typically made of aluminum or copper and acts as a bridge – allowing the heat from the electronic device to transfer to the sink and dissipate into the air. The fan is powered by a 12V power supply and is designed to draw the hot air away from the device. This helps to reduce the heat build-up inside the device which can lead to device malfunctions and other issues. The HSE-B18635-035H-04 is designed to reduce the temperature around the device by 4°C to 10°C and can ensure a device will not overheat under strenuous conditions.The HSE-B18635-035H-04 thermal - heat sink is designed for a wide range of applications. It can be used in computers, communications systems, medical imaging equipment, and many other applications that require active cooling. The HSE-B18635-035H-04 is also used in embedded systems and industrial control systems due to its strong cooling performance and small footprint. This thermal heat sink is also used in automotive applications such as engine control units and other car electronic components that require active cooling.Since its launch in 2012, the HSE-B18635-035H-04 thermal heat sink has become an essential component for many electronics and industrial applications. It is noted for its strong cooling performance and small size, making it a great choice for designers and engineers who require an effective cooling solution for their projects. The HSE-B18635-035H-04 thermal heat sink has been used in a variety of applications all around the world, demonstrating its efficacy in providing cooling to electronic devices.

The specific data is subject to PDF, and the above content is for reference