| Allicdata Part #: | 102-4238-ND |
| Manufacturer Part#: |
HSE-B20250-040H |
| Price: | $ 0.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEAT SINK, EXTRUSION, TO-220, 25 |
| More Detail: | Heat Sink TO-220 Aluminum Alloy 5.0W @ 75°C Board ... |
| DataSheet: |  HSE-B20250-040H Datasheet/PDF |
| Quantity: | 377 |
| 1 +: | $ 0.37170 |
| 10 +: | $ 0.35280 |
| 25 +: | $ 0.33516 |
| 50 +: | $ 0.32634 |
| 100 +: | $ 0.32193 |
| 250 +: | $ 0.29988 |
| 500 +: | $ 0.28224 |
| 1000 +: | $ 0.25578 |
| 5000 +: | $ 0.24696 |
| Series: | HSE |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | 5.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 4.28°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 15.00°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks are a type of passive cooling device which uses large surface area to dissipate large amounts of heat generated by electronic components and circuits. The HSE-B20250-040H is an example of a heat sink specifically designed to dissipate heat from high-powered components such as CPUs, GPUs, and other high-performance integrated circuits.
The HSE-B20250-040H consists of a metal base connected to several thin fins of aluminum or copper. The metal base is usually made of aluminum and is designed to effectively transfer heat away from the components and into the fins. The fins are designed to increase surface area of the heat sink, which allows more heat to be dissipated. By increasing the surface area of the heat sink, more air can be circulated around the device, providing a more efficient means of cooling. The additional surface area of the fins also helps to reduce the amount of noise produced by the cooling device.
In order to provide increased efficiency in heat dissipation, the HSE-B20250-040H features a unique air gap between the base and the fins. This air gap helps to ensure that the heat is evenly dispersed throughout the entire heat sink, rather than just being concentrated on the base. The air gap also helps to reduce the thermal resistance of the heat sink, which allows the heat to quickly dissipate. This helps to prevent the components from becoming too hot and reduces the chance of damage caused by excessive heat.
The HSE-B20250-040H also includes several fan clips which can be used to attach fans to the heat sink. Fans can be used to blow air across the fin surface, providing increased cooling performance. Fans can be used in addition to the air gap to ensure optimal cooling performance and to reduce the amount of noise produced by the device.
Due to its superior cooling performance, the HSE-B20250-040H is typically used in high-powered applications such as server farms, video gaming consoles, and other applications that require components capable of handling large amounts of heat. It is also used in smaller applications, such as desktop PCs, to help keep components cool and to reduce the chance of damage caused by excessive heat.
The HSE-B20250-040H is a great example of an effective and efficient heat sink which can provide excellent cooling performance in a wide range of applicatons. Its unique design helps to maximize surface area, reduce thermal resistance, and increase the cooling performance of the device. As a result, it can be used to ensure maximum performance and efficiency in high-powered applications requiring superior cooling performance.
The specific data is subject to PDF, and the above content is for reference