HSE-B20380-040H Allicdata Electronics
Allicdata Part #:

HSE-B20380-040H-ND

Manufacturer Part#:

HSE-B20380-040H

Price: $ 0.39
Product Category:

Fans, Thermal Management

Manufacturer: CUI Inc.
Short Description: HEAT SINK, EXTRUSION, TO-220, 38
More Detail: Heat Sink TO-220 Aluminum Alloy 7.4W @ 75°C Board ...
DataSheet: HSE-B20380-040H datasheetHSE-B20380-040H Datasheet/PDF
Quantity: 1000
1200 +: $ 0.34713
Stock 1000Can Ship Immediately
$ 0.39
Specifications
Series: HSE
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: PC Pin
Shape: Rectangular, Fins
Length: 1.496" (38.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.492" (12.50mm)
Power Dissipation @ Temperature Rise: 7.4W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.94°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.14°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

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Thermal - Heat Sinks are an integral part of the electronics industry, as they provide the necessary cooling solutions for many electronic components. The HSE-B20380-040H is a heat sink designed for use in power electronics applications. It is designed to provide efficient cooling in most environments, and is suitable for a wide variety of applications.

The HSE-B20380-040H is a heat sink with dual fins, designed to dissipate heat away from critical components. It is made of aluminum and has a surface area of 410mm x 90mm, making it one of the larger heat sinks available. The design of the heat sink also features an integrated convection fin, which helps to increase thermal efficiency.

The heat sink is designed to provide an efficient and cost effective solution for cooling electronics components, while still being able to fit into a variety of different applications. It is designed to make contact with the component being cooled and the heat sink as much as possible, helping to ensure that the heat is efficiently dissipated. The dual-fin design helps to evenly distribute the heat over the entire surface area, helping to reduce thermal stress on the components and helps to keep the components within their acceptable temperature range.

The HSE-B20380-040H is designed to fit within tight spaces and has a range of mounting options. It is designed to be suitable for through-board, surface-mounted and even chassis-mounted applications. This makes it a great choice for applications that have tight space constraints and need a good heat sink solution. It also has a number of mounting holes to fit screws, which can help to secure the heat sink into place.

The HSE-B20380-040H has a number of features to help with cooling performance. It has an aluminum base which helps to conduct heat away from the components and also features fins that have a low thermal resistance. This helps to ensure that heat is transferred away from the component and dissipated to environment more efficiently. Additionally, there is also a low-pressure drop design, helping to ensure that there is minimal restrictions to airflow.

The HSE-B20380-040H is a great heat sink solution for power electronics applications. It is designed to provide an efficient and cost-effective solution for cooling electronics components, while still being versatile enough to fit into a variety of different applications. It has a range of impressive features, such as its dual fin design, aluminum base, and low-pressure drop design, which make it an ideal choice for any application which requires efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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