Allicdata Part #: | HSE-B20381-035H-01-ND |
Manufacturer Part#: |
HSE-B20381-035H-01 |
Price: | $ 0.43 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CUI Inc. |
Short Description: | HEAT SINK, EXTRUSION, TO-220, 38 |
More Detail: | Heat Sink TO-220 Aluminum Alloy 7.0W @ 75°C Board ... |
DataSheet: | HSE-B20381-035H-01 Datasheet/PDF |
Quantity: | 1000 |
1200 +: | $ 0.38367 |
Specifications
Series: | HSE |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.500" (38.10mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 7.0W @ 75°C |
Thermal Resistance @ Forced Air Flow: | 2.67°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 10.71°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Description
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The HSE-B20381-035H-01 is a thermal-heat sink product, typically employed in industrial-grade electrical and electronic processes. It consists of a plate made of a durable, low-heat conductive material, such as aluminum, and a flat fin of either aluminum or copper. The fins are spaced at regular intervals along the top and bottom of the plate, increasing the surface area and thus improving its heat-transferability. In order for the device to be effective, it must be securely mounted to the surface of the electronics and connected to a reliable heat source.The working principle behind the HSE-B20381-035H-01 is relatively simple and effective. When connected to the heat source, the hot air is naturally drawn across the fins and into the gap between the plate and the device\'s surface. This air is then cooled by the conductive material of the plate, which absorbs the heat and dissipates it across the entire surface of the device. In this way, the hot air is effectively transferred from the heat source to the HSE-B20381-035H-01 and then radiated into the environment.The HSE-B20381-035H-01 is capable of cooling components with an input temperature of up to 120 °C, making it suitable for use in high-power automotive, consumer device, and industrial applications. Heat dissipated from the device can vary depending on the size of the device, the amount of airflow passing through it, and ambient temperatures, making it important to calculate the heat dissipation required for each individual situation. Its versatility makes it suitable for a wide range of applications, including embedded chassis, server racks, fan assemblies, power conversion systems, and high-power amplifiers.The HSE-B20381-035H-01 can be an effective and reliable solution for managing heat transfer in industrial-grade electronics. By providing a stable heat source and dissipating the heat across a large surface area, it is capable of transferring a large amount of heat away from the delicate components. It is also relatively easy to install and maintain, making it an ideal choice for those looking for a cost-effective solution.
The specific data is subject to PDF, and the above content is for reference
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