| Allicdata Part #: | HSE-B20381-035H-ND |
| Manufacturer Part#: |
HSE-B20381-035H |
| Price: | $ 0.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEAT SINK, EXTRUSION, TO-220, 38 |
| More Detail: | Heat Sink TO-220 Aluminum Alloy 6.5W @ 75°C Board ... |
| DataSheet: |  HSE-B20381-035H Datasheet/PDF |
| Quantity: | 1000 |
| 1200 +: | $ 0.38367 |
| Series: | HSE |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.500" (38.10mm) |
| Width: | 1.375" (34.93mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | 6.5W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 3.66°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 11.54°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks are among the most important components in any electronic system. The HSE-B20381-035H is a heat sink specifically designed to dissipate large amounts of heat quickly. It is a combination of a high-performance metallic heat sink, a FR-4 PCB-mountable theopressure mounting assembly, an aluminum sheet, and a self-closing heat conduction film designed for mounting around the face of the component.
The HSE-B20381-035H is designed primarily to dissipate large amounts of heat generated by components such as microprocessors, power transistors, MEMS and other components with high thermal mass. The heat sink features an extremely low thermal resistance (0.5 K/W), making it capable of dissipating large amounts of heat quickly and efficiently. To optimize its thermal performance, the heat sink is coated with a highly-reflective aluminium plate which reflects heat away from the heat source.
The HSE-B20381-035H also features an advanced FR-4 PCB-mountable thermopressure mounting assembly. This allows the heat sink to be securely and accurately mounted to the component board. To ensure a secure fit, the thermopressure mounting assembly features a spring-loaded latch system that is designed to firmly grip the component board. This ensures that the heat sink can effectively dissipate heat away from the component board without loosening over time.
The HSE-B20381-035H also features a self closing heat conduction film which is designed to provide additional thermal protection for the component board. This film is placed between the component board and the heat sink to create an additional layer of insulation that prevents heat from escaping the component board. This additional layer of thermal protection helps to improve the overall efficiency of the component\'s thermal performance.
Overall, the HSE-B20381-035H is a high-performance heat sink that is specifically designed to quickly dissipate large amounts of heat. Its high-performance features such as its low thermal resistance, FR-4 PCB-mountable thermopressure mounting assembly, and self-closing heat conduction film make it an ideal choice for any system in need of efficient thermal management.
The specific data is subject to PDF, and the above content is for reference