| Allicdata Part #: | HSE-B20381-056H-ND |
| Manufacturer Part#: |
HSE-B20381-056H |
| Price: | $ 0.55 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEAT SINK, EXTRUSION, TO-220, 38 |
| More Detail: | Heat Sink TO-220 Aluminum Alloy 6.7W @ 75°C Board ... |
| DataSheet: |  HSE-B20381-056H Datasheet/PDF |
| Quantity: | 1000 |
| 1200 +: | $ 0.49392 |
| Series: | HSE |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.500" (38.10mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | 6.7W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 3.53°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 11.19°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
The HSE-B20381-056H is one of the most popular thermal-heat sinks on the market today. As its name implies, it is an extremely efficient heat sink, designed to dissipate large amounts of heat from delicate electronic components in a safe and controlled manner. This type of heat sink can be found in a wide variety of applications, from large-scale industrial systems to small consumer electronics.
The HSE-B20381-056H heat sink is composed of a precisely engineered frame made of aluminum, copper, or some other high-performance metal alloy. Inside the frame is a set of carefully arranged plates, which are made of the same material and feature thin walls for improved heat dissipation. The plates are arranged in an efficient heat flux pattern that helps capture heat from the components and disperse it quickly, without causing any damages.
The HSE-B20381-056H also includes a set of aluminum fins that are externally affixed to increase the surface area of the heat sink. The fins draw heat away from the main frame and into the fins, thus ensuring a constant and consistent rate of heat dissipation. The fins also help to reduce the temperature of the surrounding air around the device, further reducing the risk of overheating.
In addition, the HSE-B20381-056H also features an innovative mounting system. This system includes adjustable brackets that enable the heat sink to fit snugly over any size component such as transistors, ICs, memory chips, and other delicate parts. This ensures that the heat sink is properly integrated into any installation, and the adjustable brackets also provide secure connections, further improving the overall effectiveness of the device.
Overall, the HSE-B20381-056H is an excellent choice for heat dissipation in a wide range of applications. Its precise construction and efficient heat flux pattern make it one of the most reliable and efficient thermal-heat sinks on the market today. It is perfect for use in any number of small to medium-sized applications, where the safe and efficient transfer of heat is absolutely essential.
The specific data is subject to PDF, and the above content is for reference