| Allicdata Part #: | HSE-B20500-040H-01-ND |
| Manufacturer Part#: |
HSE-B20500-040H-01 |
| Price: | $ 0.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEAT SINK, EXTRUSION, TO-220, 50 |
| More Detail: | Heat Sink TO-220 Aluminum Alloy 8.9W @ 75°C Board ... |
| DataSheet: |  HSE-B20500-040H-01 Datasheet/PDF |
| Quantity: | 1000 |
| 1800 +: | $ 0.42935 |
| Series: | HSE |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.359" (34.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | 8.9W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 8.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 8.43°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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The HSE-B20500-040H-01 is a thermal-heat sink designed to provide efficient and cost-effective thermal management solutions in a wide variety of applications. It features a large, strategically placed baseplate that is designed to absorb heat efficiently and swiftly dissipate it, thus eliminating the need for additional cooling devices. As such, it offers an ideal solution for high power applications that require a highly efficient heat sinking solution.
The HSE-B20500-040H-01 consists of a single piece aluminum body with a large base plate. This type of heat sink structure provides an improved heat dissipation profile and increases the dissipation rate of the heat sink. Additionally, the low profile design ensures that the sink has a low profile and is easy to install.
The base plate of the HSE-B20500-040H-01 is designed to absorb and release heat rapidly. The heat is then transferred from the aluminum body of the sink and dissipated by the large base plate. Heat is also absorbed on the opposite side of the aluminum body, making it an effective cooling device. Additionally, the HSE-B20500-040H-01 features a finned design that enhances the area of the sink’s surface area, thus improving the cooling efficiency.
The HSE-B20500-040H-01 is an effective thermal management solution for a wide range of applications, including processors, power supplies, motor control circuitry, memories, and other electronics components. It offers a better solution than passive heatsinks due to its improved thermal transfer efficiency and better heat distribution. Additionally, the aluminum body of the sink helps reduce the total weight of the system, as well as the size of the system.
The working principle of the HSE-B20500-040H-01 is fairly straightforward. The aluminum body absorbs heat from the component and the base plate releases heat quickly. This creates a steady and efficient release of heat from the system. The aluminum body then dissipates heat through the body and increases the cooling efficiency of the system.
The HSE-B20500-040H-01 is an ideal thermal management solution for many applications where cost-effectiveness, performance, and reliability are key priorities. It can be used in high power electronics systems, ICs, memories, and other components. Given its design and effectiveness, it is an excellent choice for high-performance applications.
The specific data is subject to PDF, and the above content is for reference