Allicdata Part #: | HSE-B20508-035H-W-ND |
Manufacturer Part#: |
HSE-B20508-035H-W |
Price: | $ 0.51 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CUI Inc. |
Short Description: | HEAT SINK, EXTRUSION, TO-220, 50 |
More Detail: | Heat Sink TO-220 Aluminum Alloy 7.8W @ 75°C Board ... |
DataSheet: | HSE-B20508-035H-W Datasheet/PDF |
Quantity: | 1000 |
1800 +: | $ 0.45864 |
Series: | HSE |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | PC Pin |
Shape: | Rectangular, Fins |
Length: | 2.000" (50.80mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 7.8W @ 75°C |
Thermal Resistance @ Forced Air Flow: | 5.17°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 9.62°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks are a crucial component in the functioning of all modern electronic devices. In order to keep all of these electronic components running smoothly, it is necessary to employ an effective cooling system. The HSE-B20508-035H-W is an ideal solution for achieving optimal cooling temperatures, as it combines a robust heat sink design with an advanced fan assembly. By utilizing the HSE-B20508-035H-W, system designers are able to provide reliable, quiet cooling performance.
Application Field
The HSE-B20508-035H-W is a highly versatile heat sink, designed for a wide range of applications. It offers low noise performance, high thermal capacity, and a minimal profile, making it suitable for a variety of electronics, including digital processors, notebook CPUs, graphics processing units (GPUs), and more. The HSE-B20508-035H-W is also an excellent choice for gaming consoles, personal computers, and any other device that requires a reliable and efficient cooling solution.
Working Principle
The HSE-B20508-035H-W works by transferring heat from internal components to the heat sink, which dissipates it via its advanced construction and fan assembly. The heat is drawn away from the internal electronics by fan-assisted, or natural convection cooling. The construction of the heat sink is designed to allow for efficient and uniform thermal transfer. The fan assembly, meanwhile, provides the necessary airflow to optimize the performance of the heat sink. The fan can be adjusted to provide either a low-noise or a high-performance cooling mode, allowing users to select the best cooling solution for their application.
The HSE-B20508-035H-W is also designed with a quiet thermal buzzer, which notifies users when internal temperatures exceed safe operating levels. This ensures that users are alerted when additional cooling is required. Additionally, the heat sink features an intelligent thermal monitoring system, which automatically adjusts the fan speed and heat sink configuration depending on the temperature of the internal components. This ensures that the device is cooled efficiently and safely.
The specific data is subject to PDF, and the above content is for reference