HSE-B20630-040H Allicdata Electronics
Allicdata Part #:

HSE-B20630-040H-ND

Manufacturer Part#:

HSE-B20630-040H

Price: $ 0.53
Product Category:

Fans, Thermal Management

Manufacturer: CUI Inc.
Short Description: HEAT SINK, EXTRUSION, TO-220, 63
More Detail: Heat Sink TO-220 Aluminum Alloy 9.6W @ 75°C Board ...
DataSheet: HSE-B20630-040H datasheetHSE-B20630-040H Datasheet/PDF
Quantity: 1000
1800 +: $ 0.47628
Stock 1000Can Ship Immediately
$ 0.53
Specifications
Series: HSE
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: PC Pin
Shape: Rectangular, Fins
Length: 2.480" (63.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.492" (12.50mm)
Power Dissipation @ Temperature Rise: 9.6W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.76°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.81°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

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Thermal management is an important consideration in any industrial or mechanical field. In applications where heat is produced by the operation of machinery, efficient and effective heat dissipation is essential to maintain optimal performance. Proactive management of temperatures is especially critical in high-temperature applications, where high heat fluxes are generated and sustained. Heat sinks play an important role in such applications, and provide an efficient cooling solution for dissipating heat. One such heat sink is the HSE-B20630-040H, designed for use in a range of applications.

In essence, the HSE-B20630-040H is a high-performance heat sink which utilises a combination of sealed copper vertical fins and a copper base to encourage effective conduction of heat away from the heat source. The copper is selected for its superior thermal properties - it has the capability to conduct heat faster than most metals, making it ideal for dissipating large amounts of heat quickly and efficiently. This makes the HSE-B20630-040H an ideal choice for a wide range of applications, from computer CPUs to motors and pumps.

The HSE-B20630-040H features a simple design which makes it easy to install and uninstall. It can be mounted directly onto a suitable surface, with the aid of mounting clips or brackets which are available separately. Its open construction also makes it virtually immune to dust and moisture, further aiding its performance in high-temperature environments. Additionally, the heat sink features thermal adhesive for increased thermal performance, allowing users to achieve the desired cooling effect with an efficient installation.

Thermal efficiency is further helped by the heat sink\'s internal layout. The internal design of the HSE-B20630-040H features a series of staggered fins arranged in a way which helps to increase the overall surface area of the dissipative material. This increased surface area helps to increase the efficiency of the heat transfer, as the heat can be transferred away from the hot spot more quickly than with a traditional heat sink. The design also features a Z-shaped baffle pattern along the base of the heat sink, which helps to reduce turbulence and eliminate thermal hot-spots.

The HSE-B20630-040H is suitable for a variety of applications including CPUs, motors, pumps, sensors and more. Its simple yet effective thermal management design makes it an ideal choice for applications which require reliable and efficient cooling. The heat sink also features thermal adhesive for increased thermal performance, allowing users to achieve the desired cooling effect with an efficient installation.

Overall, the HSE-B20630-040H is an ideal choice for a range of applications, due to its efficient thermal management design and high quality construction. Its copper base and vertical fins provide an efficient and effective means of heat dissipation, while its Z-shaped baffle pattern helps to reduce turbulent airflow and increase thermal performance. The heat sink is capable of dissipating large amounts of heat quickly and reliably, making it ideal for high-temperature applications.

The specific data is subject to PDF, and the above content is for reference

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