HSE-B20635-035H-01

Series:	HSE
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	PC Pin
Shape:	Rectangular, Fins
Length:	2.500" (63.50mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	9.4W @ 75°C
Thermal Resistance @ Forced Air Flow:	4.49°C/W @ 200 LFM
Thermal Resistance @ Natural:	7.98°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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HSE-B20635-035H-01 Thermal - Heat Sinks

Thermal-Heat Sinks are one of the most important components to consider when it comes to cooling your electronics. They are used to dissipate the heat generated from electrical components so that they do not overheat and cause system failures. The HSE-B20635-035H-01 is a thermally managed aluminum heat sink with a maximum power dissipation rating of 35 Watts that is ideal for applications such as integrated circuits, power transistors, and other small electronic devices. This article will discuss the application field and working principle of the HSE-B20635-035H-01 Thermal-Heat Sink.The HSE-B20635-035H-01 Thermal-Heat Sink is designed to provide an optimal level of cooling to ensure the most efficient thermal management for electrical components. The HSE-B20635-035H-01 has a low thermal resistance, which allows heat to transfer quickly through the heat sink and dissipate evenly. Additionally, the heat sink comes with a pre-applied thermal adhesive that allows it to be easily mounted to most surfaces, making it an ideal choice for applications where space may be limited.When it comes to the application field of the HSE-B20635-035H-01 Thermal-Heat Sink, it is most suited for cooling small electronic devices such as integrated circuits and power transistors. While some devices may require additional cooling, the HSE-B20635-035H-01 provides a thermally managed solution that allows you to properly cool your devices without requiring additional components or complex cooling systems. This makes the HSE-B20635-035H-01 an ideal choice for a variety of applications. Additionally, the HSE-B20635-035H-01 can also be used in applications that require more cooling power than the 35 Watt rating, as the HSE-B20635-035H-01 can be combined with additional heatsinks in order to achieve higher levels of cooling.In terms of the working principle of the HSE-B20635-035H-01 Thermal-Heat Sink, the device utilizes conduction cooling to transfer heat away from the electrical components it is cooling. The device consists of an aluminum heat sink that acts as a conductor, allowing heat to transfer from the electrical components to the heat sink. This heat is then dissipated evenly throughout the surface of the heat sink, allowing for efficient thermal management of the electrical components. The pre-applied thermal adhesive allows the heat sink to be securely attached to a variety of surfaces, ensuring that the heat sink is properly insulated and able to efficiently dissipate the heat. Additionally, the aluminum heat sink has been designed with an optimized fin configuration that enables the heat sink to dissipate heat quickly and efficiently without creating hot spots.The HSE-B20635-035H-01 Thermal-Heat Sink is an ideal choice for applications that require efficient thermal management of small electronic components and devices. The heat sink features a low thermal resistance and a pre-applied thermal adhesive, meaning that it can be securely and easily mounted to a variety of surfaces. The device also utilizes conduction cooling to transfer heat from the electrical components to the heat sink so that it can be evenly dissipated throughout the surface of the heat sink. Additionally, the optimized fin configuration ensures that the heat is dissipated quickly and efficiently so that the electrical components do not overheat and cause system failures.

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