| Allicdata Part #: | HSE-B20635-035H-W-ND |
| Manufacturer Part#: |
HSE-B20635-035H-W |
| Price: | $ 0.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEAT SINK, EXTRUSION, TO-220, 63 |
| More Detail: | Heat Sink TO-220 Aluminum Alloy 9.2W @ 75°C Board ... |
| DataSheet: |  HSE-B20635-035H-W Datasheet/PDF |
| Quantity: | 1000 |
| 1800 +: | $ 0.59094 |
| Series: | HSE |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.500" (63.50mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | 9.2W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 4.35°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 8.15°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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The HSE-B20635-035H-W Heat Sink is an example of thermal management that helps regulate and dissipate heat from an electronic device or circuit. This heat sink is specifically designed to be used in the miniaturization of some of today’s popular electronics, such as laptops, tablets, and smartphones. Heat sinks provide thermal management to components by helping to control their operating temperature and to prevent overheating. When heat accumulates within an electronic component, it can lead to all sorts of problems. The device may not perform as expected, it may crash, or it may even become damaged beyond repair. The HSE-B20635-035H-W Heat Sink is a rugged and reliable product that provides the thermal oversight necessary to prevent these issues from occurring.
The HSE-B20635-035H-W Heat Sink is designed for use in air-cooled applications. It is made of a rugged copper body that is designed to conserve heat efficiently. The body of the heat sink is also constructed of finbonds, which help to improve heat dissipation and thermal performance. Additionally, the thick copper foil helps to reduce interference for nearby components. The heat sink also has an anodized black finish for a sleek, aesthetic look. This heat sink is also highly compatible, making it easy to integrate into a wide range of electronic systems and applications.
The working principle of the HSE-B20635-035H-W Heat Sink is simple and effective. The heat generated by the electronic components or circuits is transferred to the heat sink via conduction. The heat sink is designed to absorb and dissipate this heat efficiently and effectively. The heat sink then dissipates the heat away from the components and into the surrounding environment. This helps to keep the temperature of the components within the operating limits that are necessary for reliable and efficient performance.
The specific application fields of the HSE-B20635-035H-W Heat Sink are broad and diverse. This heat sink is suitable for use in electronic systems that contain high-power components, such as CPUs, GPUs, SoCs, and power amplifiers. The high-thermal conductivity of the heat sink and its compatibility with various miniaturized devices make it ideal for applications within laptops, tablets, and smartphones. Additionally, this heat sink is well-suited for industrial and commercial applications, such as medical equipment, automotive electronics, and consumer appliances.
The HSE-B20635-035H-W Heat Sink is an effective and reliable product that helps to manage the temperature and performance of all kinds of electrical components and circuits. Its simple design and compatibility make it an ideal choice for many applications. With its efficient thermodynamic properties and sleek, aesthetic look, the HSE-B20635-035H-W Heat Sink is sure to provide the performance and reliability you need for your projects.
The specific data is subject to PDF, and the above content is for reference