HSE-B20635-035H Allicdata Electronics
Allicdata Part #:

HSE-B20635-035H-ND

Manufacturer Part#:

HSE-B20635-035H

Price: $ 0.64
Product Category:

Fans, Thermal Management

Manufacturer: CUI Inc.
Short Description: HEAT SINK, EXTRUSION, TO-220, 63
More Detail: Heat Sink TO-220 Aluminum Alloy 9.2W @ 75°C Board ...
DataSheet: HSE-B20635-035H datasheetHSE-B20635-035H Datasheet/PDF
Quantity: 1000
1200 +: $ 0.57330
Stock 1000Can Ship Immediately
$ 0.64
Specifications
Series: HSE
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: PC Pin
Shape: Rectangular, Fins
Length: 2.500" (63.50mm)
Width: 1.375" (34.93mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 9.2W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.35°C/W @ 200 LFM
Thermal Resistance @ Natural: 8.15°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal conduction is the transfer of heat across a material, and plays a vital role in regulating temperature in a variety of applications. Heat sinks are special components designed to dissipate heat away from its source, often in the form of an electronic device or heatsink. The HSE-B20635-035H is one such device, and is characterized by its advanced engineering design and superior thermal performance.

The HSE-B20635-035H is a type of heat sink, with its application field spearheaded in various high temperature fields. It is commonly used in combination with cooling fans and other active cooling components, and is often suitable for limited space environment applications. Its primary working principle is based on the concept of thermal conductivity – that is, heat transfer from the source to the sink. In general, higher thermal conductivity between the two components leads to rapid and effective heat dissipation.

The HSE-B20635-035H heat sink is designed with an innovative “airflow back plate and flange” structure. This consists of a wide array of micro fins that help to decrease the thermal resistance between the source and sink. The micro fins also optimize the airflow to ensure an effective cooling system. To put it simply, when the heat dissipation rises from the source, the fan will start to take in air from the bottom of the heat sink and discharge it out of the top at a high velocity. This creates an active cooling effect, helping to transfer more heat away from the source every second.

To further improve its thermal capabilities, the HSE-B20635-035H heat sink features an advanced aluminium “balance fin” construction that increases surface area and dissipates heat effectively from the source. This is then paired with a slim heat sink wall that helps users to precisely secure the device and further increase the cooling efficiency.

The HSE-B20635-035H is also constructed to meet the needs of both commercial and industrial applications. Its advanced technical design provides excellent thermal performance along with reliable installation. Moreover, the device is also designed to be completely dustproof, making it an ideal option for both air-cooled and liquid-cooled cooling systems.

In conclusion, the HSE-B20635-035H is a specialized heat sink that offers unparalleled thermal performance in limited space environment applications. Its advanced aluminium construction, “airflow back plate and flange” structure, and “balance fin” design all work together to dissipate heat away from the source, providing users with a reliable and efficient cooling solution.

The specific data is subject to PDF, and the above content is for reference

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