| Allicdata Part #: | 102-4226-ND |
| Manufacturer Part#: |
HSE-B2111-038 |
| Price: | $ 0.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEAT SINK, EXTRUSION, TO-220, 25 |
| More Detail: | Heat Sink TO-220 Aluminum Alloy 3.8W @ 75°C Board ... |
| DataSheet: |  HSE-B2111-038 Datasheet/PDF |
| Quantity: | 914 |
| 1 +: | $ 0.22680 |
| 10 +: | $ 0.21420 |
| 25 +: | $ 0.20362 |
| 50 +: | $ 0.19820 |
| 100 +: | $ 0.19549 |
| 250 +: | $ 0.18207 |
| 500 +: | $ 0.17136 |
| 1000 +: | $ 0.15530 |
| 5000 +: | $ 0.14994 |
| Series: | HSE |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On |
| Shape: | Rectangular |
| Length: | 0.984" (25.00mm) |
| Width: | 0.625" (16.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.354" (9.00mm) |
| Power Dissipation @ Temperature Rise: | 3.8W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 6.12°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 19.74°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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The HSE-B2111-038 is a type of thermal-heat sink that is used in a variety of applications. This heat sink works to dissipate heat away from sensitive electronic components, such as processors and other semiconductor devices. Heat sinks are commonly used in computers, power supplies, and other electronic systems. The HSE-B2111-038 thermal-heat sink is designed to be used in a wide variety of applications, ranging from consumer electronics, to servers and other larger systems.
The HSE-B2111-038 thermal-heat sink uses a combination of materials and structures to create a more efficient way of dissipating heat. The sink itself is made up of a copper base, aluminum fins, and a fan to circulate air through the fins. This combination works to maximize the heat transfer from the copper base to the aluminum fins, thus dissipating the heat away from the applications. The fan sits between the copper base and the aluminum fins, and helps to direct the air flow through the fins, increasing the effectiveness of the heat transfer.
The HSE-B2111-038 thermal-heat sink is designed to be used in a variety of applications. These applications range from small consumer electronics, such as phones or laptops, to larger servers and data centers. It is designed to be used in systems that have a large demand for heat dissipation. It is capable of dissipating high levels of heat in short periods of time.
The HSE-B2111-038 thermal-heat sink is designed to be highly efficient and reliable, making it suitable for a variety of different applications. The design of the sink incorporates several features that increase both its efficiency and reliability.The copper base and aluminum fins provide a highly effective way of dissipating the heat away from the application. The fan creates an air flow that helps to transport heat away from the application quickly and efficiently. Finally, the sink is designed to be easy to install and maintain.
The HSE-B2111-038 thermal-heat sink provides an effective way of dissipating heat away from sensitive electronic components. It is designed to be used in a variety of different applications, ranging from consumer electronics to servers and data centers. The sink uses a combination of materials and structures to create an efficient way of dissipating heat away from the application. The fan helps to direct the air flow through the fins, increasing the effectiveness of the heat transfer. Finally, the sink is designed to be easy to install and maintain, making it suitable for a variety of different applications.
The specific data is subject to PDF, and the above content is for reference