| Allicdata Part #: | 102-4229-ND |
| Manufacturer Part#: |
HSE-B250-04H |
| Price: | $ 0.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEAT SINK, EXTRUSION, TO-220, 25 |
| More Detail: | Heat Sink TO-220 Aluminum Alloy 8.0W @ 75°C Board ... |
| DataSheet: |  HSE-B250-04H Datasheet/PDF |
| Quantity: | 583 |
| 1 +: | $ 0.52920 |
| 10 +: | $ 0.50400 |
| 25 +: | $ 0.47880 |
| 50 +: | $ 0.46620 |
| 100 +: | $ 0.45990 |
| 250 +: | $ 0.42840 |
| 500 +: | $ 0.40320 |
| 1000 +: | $ 0.36540 |
| 5000 +: | $ 0.35280 |
| Series: | HSE |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.000" (25.40mm) |
| Power Dissipation @ Temperature Rise: | 8.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 3.26°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 9.38°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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The HSE-B250-04H is part of a thermal-heat sink series that is used to aid in the cooling of electronics. This particular model features a rugged construction with a design that makes installation easier than older models. It utilizes copper-based technology which takes advantage of the superior thermal properties of copper as compared to other materials such as aluminum. This type of technology helps reduce the amount of operational temperature in electrical systems, which can be extremely important for those systems which are dealing with volatile or sensitive electronics.
Generally speaking, this device works by transferring heat away from the component or components it is attached to. This heat transfer is done via conduction, where the copper heatsink allows heat generated by the component to pass into the heatsink material. Once the heat has been transferred to the heatsink, it is then dissipated into the air by small fans which are attached to the heatsink itself. This method helps to lower the temperature of the components.
The HSE-B250-04H heatsink has a number of key advantages. Firstly, the copper-based technology allows for better thermal performance than aluminum-based models. Secondly, the installation of the device is made simpler due to its rugged design. Finally, the device is capable of dissipating high levels of heat, making it a great choice for systems utilizing volatile or sensitive electronics. Aside from these advantages, the device is also cost-effective, making it a suitable choice for a variety of applications.
Overall, the HSE-B250-04H thermal-heat sink is an effective way to reduce the operating temperature of electronic components. The copper-based technology allows for superior thermal performance and the rugged construction helps to make installation simpler. Furthermore, the device offers good cost efficiency, making it a great choice for a variety of applications. Whether the application is for dissipating heat in volatile electronics or simply making sure sensitive components don’t overheat, the HSE-B250-04H thermal-heat sink offers a great solution.
The specific data is subject to PDF, and the above content is for reference