HSE-B254-045H Allicdata Electronics
Allicdata Part #:

102-4228-ND

Manufacturer Part#:

HSE-B254-045H

Price: $ 0.57
Product Category:

Fans, Thermal Management

Manufacturer: CUI Inc.
Short Description: HEAT SINK, EXTRUSION, TO-220, 25
More Detail: Heat Sink TO-220 Aluminum Alloy 6.4W @ 75°C Board ...
DataSheet: HSE-B254-045H datasheetHSE-B254-045H Datasheet/PDF
Quantity: 1123
1 +: $ 0.51660
10 +: $ 0.49140
25 +: $ 0.46696
50 +: $ 0.45461
100 +: $ 0.44843
250 +: $ 0.41769
500 +: $ 0.39312
1000 +: $ 0.35627
5000 +: $ 0.34398
Stock 1123Can Ship Immediately
$ 0.57
Specifications
Series: HSE
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: PC Pin
Shape: Rectangular, Fins
Length: 1.000" (25.40mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 6.4W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.86°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.72°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks, otherwise known as heat dissipators, are devices commonly used to reduce the temperature of a particular component or assembly by transferring thermal energy away from the source. This is usually done through a combination of thermal radiation and convection. One of the most popular forms of heat dissipators, on the market today, is the HSE-B254-045H.

The HSE-B254-045H is designed to dissipate heat away from the source, while providing excellent thermal performance at the same time. The device contains a base plate made from anodized aluminum, which is then coupled with a cold plate made from copper. This combination allows for excellent thermal performance while simultaneously reducing the total weight of the device. Additionally, the device features a fan-cooled structure, which helps to further increase cooling efficiency by providing additional air movement.

The device is designed to dissipate waste heat from a variety of applications, such as those found in consumer electronics, medical instrumentation, industrial automation, and military technology. Because of its high level of thermal performance, the device is ideal for applications which require a rapid response, such as those found in medical instrumentation. It is also suitable for applications willing to trade higher costs for better efficiency, such as those in industrial automation.

The operating principle behind the device\'s thermal dissipation capability is known as the “law of thermodynamics”. This principle states that thermal energy is either transferred or dissipated away from a source in the form of heat, as a result of its contact with another source of energy. In the case of the HSE-B254-045H, the thermal energy is dissipated away from the source in the form of heat as a result of its contact with the cold plate. This allows the device to absorb the thermal energy and dissipate it away from the source, thereby reducing the temperature of the component or assembly.

In summary, the HSE-B254-045H is a thermal-heat sink device which can be used to reduce the temperature of a particular component or assembly by transferring thermal energy away from the source. The device is designed to dissipate waste heat from a variety of applications, and its operating principle is based on the “law of thermodynamics”. The device is ideal for rapid response applications where higher costs are acceptable in order to achieve better efficiency.

The specific data is subject to PDF, and the above content is for reference

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