| Allicdata Part #: | HSE-B381-045H-ND |
| Manufacturer Part#: |
HSE-B381-045H |
| Price: | $ 0.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEAT SINK, EXTRUSION, TO-220, 38 |
| More Detail: | Heat Sink TO-220 Aluminum Alloy 9.9W @ 75°C Board ... |
| DataSheet: |  HSE-B381-045H Datasheet/PDF |
| Quantity: | 1000 |
| 1800 +: | $ 0.46746 |
| Series: | HSE |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.500" (38.10mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | 9.9W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 2.63°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 7.58°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks are an essential part of any electronic system as they help to dissipate the heat generated by the active components. The HSE-B381-045H is one such heat sink from the HSE-B381 series, specifically designed for high-power applications. This article will outline the application field of the HSE-B381-045H, as well as explaining its working principle.
The HSE-B381-045H is most commonly used for high-current and/or high-frequency amplifiers and power supplies. This is because the heat sink has the combined abilities of high-power dissipation and good thermal conduction, which make it the ideal choice for such a wide range of applications. It is also suitable for applications where space is an issue, as the HSE-B381-045H has a compact design that allows it to fit into tight areas with ease.
The HSE-B381-045H has a total power dissipation of 105W, allowing it to handle high power-load components without any significant issues. The heat sink is also constructed from a durable aluminum alloy that ensures the highest thermal conduction. This ensures that the heat generated is quickly dissipated, keeping the device operating at its optimal temperature.
The HSE-B381-045H works on the principle of natural convection. The heat generated by the component is transferred to the heat sink through thermal bonding. Once the heat sink has absorbed the heat, it is then dissipated into the surrounding environment through natural convection. As the air around the heat sink is heated, it rises and creates a vacuum, which pulls in new, cooler air from the sides. This cooler air is what helps to cool down the heat sink.
The HSE-B381-045H also features an innovative design that makes it easy to mount onto any device. It features two mounting flanges that can be adjusted to fit most components. This ensures a secure fit and helps to prevent any type of slippage. Additionally, the heat sink also includes a thermal-resistant silicone pad that reduces the heat transfer coefficient in order to achieve maximum efficiency.
Overall, the HSE-B381-045H is an ideal choice for a variety of high-power applications. Its combination of high-power dissipation and good thermal conduction make it the perfect choice for amplifiers, power supplies, and other high-heat components. With its easy-to-install design and reliable performance, the HSE-B381-045H is sure to help keep your system running at its peak.
The specific data is subject to PDF, and the above content is for reference