| Allicdata Part #: | HSE-B630-04H-ND |
| Manufacturer Part#: |
HSE-B630-04H |
| Price: | $ 0.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEAT SINK, EXTRUSION, TO-220, 63 |
| More Detail: | Heat Sink TO-220 Aluminum Alloy 14.4W @ 75°C Board... |
| DataSheet: |  HSE-B630-04H Datasheet/PDF |
| Quantity: | 1000 |
| 1200 +: | $ 0.71442 |
| Series: | HSE |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.480" (63.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.000" (25.40mm) |
| Power Dissipation @ Temperature Rise: | 14.4W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 2.31°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 5.21°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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The HSE-B630-04H thermal heat sink is used to transfer heat away from the sensitive components in electronic circuits. It is designed to dissipate heat generated by circuitry and help keep it running at an optimal level.
The HSE-B630-04H thermal heat sink utilizes a combination of aluminum and copper to conduct and transport heat from the source to the surrounding environment. The aluminum helps efficiently dissipate the heat, while the copper provides a robust connection between the circuit and the heat sink. The thermal heat sink also features a cooling fan, which helps maintain the temperature range of the circuit.
The working principle of the HSE-B630-04H thermal heat sink is simple. Heat is generated in the circuitry and conducted to the heat sink by means of the aluminum and copper components. The heat is then dissipated to the surrounding environment by convection or radiation. The cooling fan helps to ensure that the temperature is kept within the acceptable range.
The HSE-B630-04H thermal heat sink has a wide range of applications. It is commonly used in high-performance computing, networking, and storage systems. It can also be used in power supplies, industrial automation, and aerospace applications. Additionally, this type of heat sink can be utilized in small form factor computers, embedded systems, and data centers in order to effectively manage heat.
The specific data is subject to PDF, and the above content is for reference