HSE-B635-045H Allicdata Electronics

HSE-B635-045H Fans, Thermal Management

Allicdata Part #:

HSE-B635-045H-ND

Manufacturer Part#:

HSE-B635-045H

Price: $ 0.90
Product Category:

Fans, Thermal Management

Manufacturer: CUI Inc.
Short Description: HEAT SINK, EXTRUSION, TO-220, 63
More Detail: Heat Sink TO-220 Aluminum Alloy 11.7W @ 75°C Board...
DataSheet: HSE-B635-045H datasheetHSE-B635-045H Datasheet/PDF
Quantity: 1000
1350 +: $ 0.81144
Stock 1000Can Ship Immediately
$ 0.9
Specifications
Series: HSE
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: PC Pin
Shape: Rectangular, Fins
Length: 2.500" (63.50mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 11.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.53°C/W @ 200 LFM
Thermal Resistance @ Natural: 6.41°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

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Thermal heat sinks have been a staple in electronics for decades, and in today’s world, the HSE-B635-045H is one of the most popular thermal heat sink products on the market. The HSE-B635-045H is a cylindrical heat sink, designed to dissipate heat away from an electronic device by transferring it from one surface to another. It is made from aluminum alloy and has a black aluminum finish, giving it a modern, stylish look.

The HSE-B635-045H is designed to be used in applications where the normal temperature of the device must be maintained or reduced. It has a large surface area, which helps to dissipate heat quickly. In addition, its multiple layers of air circulation fins in the shape of a honeycomb design also aid in the heat dissipation process. This design helps to reduce the airflow turbulence, allowing for an even transfer of heat.

The thermal heat sink HSE-B635-045H is able to handle multiple power levels, from low to high watts. Its features allow for flexibility in installation, with thermal velocity compensation and variable mounting heights. The product has an adjustable voltage of up to 17.5V, and a low thermal resistance of 0.2K/W. The thermal resistance can be further decreased with the use of thermal gap fillers, allowing for a greater area of contact between the heat sink and the device. When it comes to noise, the HSE-B635-045H is designed to meet EMI/RFI standards.

The HSE-B635-045H is designed to work with a variety of cooling fans, as well as being compatible with other devices such as power supplies. With its spiral fin design, it is able to dissipate heat quickly and evenly, providing optimal performance. It can also be used with a variety of temperature controllers, as well as temperature probes.

When using the HSE-B635-045H, it is important to take into account the cooling requirements of the device that it is being used with. This includes the required voltage, current, and environmental conditions. It is also important to calculate the thermal impedance of the device to ensure that the heat sink is able to handle the applied power levels. It is also important to take into account the ambient temperature, as higher temperatures will require more cooling power from the heat sink.

The HSE-B635-045H is a versatile and reliable thermal heat sink, which is ideal for applications where it is important to maintain ambient temperatures. Its flexibility in installation, and its low thermal resistance, make it a great choice for a number of different electronic applications. With its sleek look and durable finish, the HSE-B635-045H is sure to provide years of reliable service.

The specific data is subject to PDF, and the above content is for reference

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