| Allicdata Part #: | 345-1601-ND |
| Manufacturer Part#: |
HSF-48-19-B-F |
| Price: | $ 23.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 5VDC 47.5X47.5X18.5MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-48-19-B-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 21.06090 |
| 10 +: | $ 19.82230 |
| 25 +: | $ 18.58330 |
| 50 +: | $ 17.34420 |
| 100 +: | $ 16.72480 |
| 250 +: | $ 15.79570 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 1.870" (47.50mm) |
| Width: | 1.870" (47.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.728" (18.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 1.41°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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A thermal heat sink is a device that is typically used to dissipate heat from an electronic device. Heat sinks most commonly consist of a metal plate or block of metal that has fins protruding from one side, designed to increase the surface area and enhance its conduction of heat away from the device. One such model of thermal heat sink is the HSF-48-19-B-F.
The HSF-48-19-B-F is designed to be used in a wide variety of applications that require high levels of heat dissipation. Common applications of this model include high-powered semiconductors, such as CPUs, GPUs, and other integrated circuits, and high-efficiency lighting systems. Additionally, this model can also be used in air-conditioning systems, making it a versatile choice for a variety of applications.
The HSF-48-19-B-F is constructed of aluminum and has a total size of 48mm x 19mm. This size allows for a maximum heat dissipation of up to 37.0W. It has an integrated fan and comes equipped with a mounting bracket and screws. The design of this model enables it to fit into small spaces, allowing it to be used in a variety of electronic device enclosures.
The HSF-48-19-B-F features a single fan that runs at a maximum speed of 3200RPM. This fan is designed to quickly and efficiently dissipate the heat generated by the device it is attached to. The fan is also equipped with a temperature sensor that is used to regulate the power consumption and speed of the fan. This ensures that the device will not become overheated.
The HSF-48-19-B-F also features a lightweight aluminum extrusion that is designed to provide stability and support for the fan and the entire heat sink. This helps to ensure that the fan does not become damage and that it can function efficiently without risking any potential damage to the device.
The HSF-48-19-B-F features a low-profile design, which helps to reduce the amount of space it takes up in an enclosure. Additionally, the design also helps to reduce noise, making it an ideal choice for those who need to run their devices in a quiet environment.
Overall, the HSF-48-19-B-F is designed to provide efficient and reliable heat dissipation, making it a great choice for high-powered semiconductor devices, air-conditioning systems, and efficient lighting systems. The model\'s design also ensures that it is able to fit into small spaces and does not generate unnecessary noise levels, making it an ideal choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference