| Allicdata Part #: | 345-1603-ND |
| Manufacturer Part#: |
HSF-48-22-B-F |
| Price: | $ 23.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 5VDC 47.5X47.5X21.5MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-48-22-B-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 21.27510 |
| 10 +: | $ 20.02580 |
| 25 +: | $ 18.77400 |
| 50 +: | $ 17.52250 |
| 100 +: | $ 16.89660 |
| 250 +: | $ 15.95790 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 1.870" (47.50mm) |
| Width: | 1.870" (47.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.846" (21.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 1.14°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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Thermal – Heat Sinks are devices that use either air or a liquid to efficiently move away heat from an object to the environment. The HSF-48-22-B-F is a type of such device that utilizes air fins to direct heat away from the desired object, while also providing an efficient means for cooling. The device works by either dissipating the heated air to the surrounding environment, or by convecting it away from the object.
The HSF-48-22-B-F airflow model has been in use since 1997. Its main purpose lies in providing efficient cooling solutions for objects that generate a lot of heat during use such as processors, graphics cards, motherboards, and transistor arrays. It comes in a variety of sizes to suit different applications, and can reach up to a maximum airflow of 38.8 CFM.
The device is typically made up of an aluminum frame, ambient air fins, a fan, and a transformer to regulate the fan speed. The aluminum frame is designed to circulate and disperse the heated air away from the object and into the fins, which are used to redirect the air away from the object and into the environment. The fan is also used to draw cool air from outside the device, and then force it through the fins. This circulation helps to keep the overall temperature of the device cool.
The working principle of the HSF-48-22-B-F is very straightforward. When the device is running, the fan draws air through the fins, directing it away from the heatsink. This process works to dissipate the heat away from the source material, thus keeping the overall temperature down. At the same time, the transformer helps to regulate the fan speed to ensure that the rate of airflow is always consistent and efficient.
The HSF-48-22-B-F has become an extremely important component in the cooling of processors and other electronics that generate a large amount of heat. Its efficiency and reliability have enabled it to become the go-to choice for many different applications. The device is also relatively lightweight, meaning that it does not add any additional load on the object being cooled.
The HSF-48-22-B-F is also an excellent option for overclocking, as the device can easily handle higher temperatures due to its high airflow. This makes it ideal for those looking to push their processor or graphics card to the max.
Overall, the HSF-48-22-B-F is an efficient and reliable choice for a wide variety of thermal - heat sink applications. It is also relatively easy to install and use, making it an excellent solution for those looking to cool their PCs quickly and efficiently.
The specific data is subject to PDF, and the above content is for reference