| Allicdata Part #: | 345-1606-ND |
| Manufacturer Part#: |
HSF-48-25-Y-F |
| Price: | $ 23.87 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 5VDC 47.5X47.5X24.5MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-48-25-Y-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 21.48300 |
| 10 +: | $ 20.21920 |
| 25 +: | $ 18.95540 |
| 50 +: | $ 17.69170 |
| 100 +: | $ 17.05980 |
| 250 +: | $ 16.11200 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 1.870" (47.50mm) |
| Width: | 1.870" (47.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.98°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Introduction
The HSF-48-25-Y-F is a thermal heat sink that offers high performance for electronic applications. It is designed to provide excellent cooling solutions for various electronic components. It is also designed to offer robust, reliable and long-lasting performance. The HSF-48-25-Y-F is an optimal choice for applications with low noise and improved thermal management.
Application Fields
The HSF-48-25-Y-F is suitable for a wide range of applications. It is efficient in transferring heat from the component to the external environment, which helps to maintain a stable operating temperature. It is especially useful for applications such as high power active power supply, DC-DC converters, solar cell string/array, consumer electronics, industrial and automotive applications, and other related applications. It also has applications in motor control systems, air conditioners and LED lighting.
Additionally, its lightweight design and low profile make it perfectly suited for applications in tight spaces, such as 1U systems and 2U systems. It also provides excellent protection against thermal cycling and EMI/RFI noise.
Working Principle
The HSF-48-25-Y-F utilizes two techniques that work together in order to effectively dissipate heat: forced convection and natural convection. Forced convection, which is also often called air conduction, involves the use of a fan to create a directed airflow over the heat sink surface. This helps to move heat away from the components and into the ambient air. Natural convection on the other hand, makes use of the rising hot air to draw cool air in from the surrounding environment. The combination of these two techniques helps to efficiently transfer heat away from the device and into the environment.
The HSF-48-25-Y-F is also designed with an aluminum finned heat sink to further improve the thermal performance. The fin design helps to increase the surface area of the heat sink, which promotes the uniform distribution of heat across the entire surface area. This helps to minimize hotspots and improve overall cooling performance. The fin structure also helps to reduce air noise and turbulence, which makes the HSF-48-25-Y-F an optimal choice for applications with low noise and improved thermal management.
Conclusion
The HSF-48-25-Y-F is a high performance heat sink that is perfect for a wide range of applications. It uses both forced convection and natural convection to efficiently transfer heat away from the device and into the environment. Its aluminum finned heat sink design further enhances its ability to uniformly distribute heat and eliminates hotspots. This makes it an optimal choice for applications with low noise and improved thermal management.
The specific data is subject to PDF, and the above content is for reference