HSF-48-28-B-F Allicdata Electronics
Allicdata Part #:

345-1607-ND

Manufacturer Part#:

HSF-48-28-B-F

Price: $ 24.11
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: FANSINK 5VDC 47.5X47.5X27.5MM
More Detail: Heat Sink BGA Aluminum Alloy Top Mount
DataSheet: HSF-48-28-B-F datasheetHSF-48-28-B-F Datasheet/PDF
Quantity: 50
1 +: $ 21.69720
10 +: $ 20.42270
25 +: $ 19.14620
50 +: $ 17.86980
100 +: $ 17.23160
250 +: $ 16.27440
Stock 50Can Ship Immediately
$ 24.11
Specifications
Series: HSF
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip
Shape: Square, Fins
Length: 1.870" (47.50mm)
Width: 1.870" (47.50mm)
Diameter: --
Height Off Base (Height of Fin): 0.965" (24.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 0.88°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Thermal management products help devices avoid overheating, from computer CPUs to power converters. Heat sinks are one of the most popular of these products, as they are functional, reliable, and cost effective. One particular type of heat sink is the HSF-48-28-B-F. This article will explain the application field as well as the working principle of this thermal management product in order to help you better understand the implications of heat sinks and how they help to keep electronic devices cool.

Applications of HSF-48-28-B-F

The HSF-48-28-B-F heat sink is designed for use with 28mm by 28mm type components, making it a great choice for various applications, such as LED lighting, communications, and office electronics. It has a relatively small form factor, so it is able to fit into tighter spaces. The heat sink can also be used with high-end devices with higher temperature requirements, such as those for automotive and medical applications. All of these different applications make the HSF-48-28-B-F a great choice for a variety of purposes in order to provide a reliable and cost-effective thermal management solution.

Working Principle of HSF-48-28-B-F

The HSF-48-28-B-F heat sink utilises the principle of thermal conductivity in order to manage the temperature of the surface it is attached to. It does this by transferring the heat away from the surface and dissipating it into the surrounding air. The design of the HSF-48-28-B-F features a high-density array of heat transfer fins which helps to transfer the generated heat away from the surface more quickly. This is because the heat is transferred through the surface to the fin array and then dissipated into the air quickly. In addition to this, the heat sink also features a large base area in order to increase the efficiency of the heat transfer.

Conclusion

The HSF-48-28-B-F heat sink is a great choice for a variety of applications, from LED lighting and computing to automotive and medical. It is a reliable and cost effective thermal management product which utilises the principles of thermal conductivity in order to effectively transfer heat away from the surface and dissipate it into the surrounding air. It is also able to fit into tight spaces and is able to be used in high temperature applications. All of these features make the HSF-48-28-B-F a great choice for use in thermal management.

The specific data is subject to PDF, and the above content is for reference

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