| Allicdata Part #: | 345-1610-ND |
| Manufacturer Part#: |
HSF-48-30-Y-F |
| Price: | $ 24.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 5VDC 47.5X47.5X29.5MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-48-30-Y-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 21.92400 |
| 10 +: | $ 20.63630 |
| 25 +: | $ 19.34680 |
| 50 +: | $ 18.05690 |
| 100 +: | $ 17.41200 |
| 250 +: | $ 16.44470 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 1.870" (47.50mm) |
| Width: | 1.870" (47.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.161" (29.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.83°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important factor in determining the performance of many consumer electronics and electrical components. Thermal management can be a challenge for many of today’s applications, especially ones where space is limited or where the application requires high temperatures. The HSF-48-30-Y-F is a heat sink designed to provide efficient thermal management within a limited space. This heat sink is designed to dissipate the heat generated by components such as microprocessors, as well as other electronics.
The HSF-48-30-Y-F is a single-stage heat sink design, made of a high-performance heat-dissipating material. The unique design of this heat sink allows for maximum surface area areas to be exposed to the air. This allows for efficient cooling of electronics, as well as other components. The HSF-48-30-Y-F has a 48mmx30mm footprint, with a total height of 56.5mm. It also features a unique V-shaped fin design, which helps improve heat dissipation by increasing the surface area that is exposed to the air.
The HSF-48-30-Y-F can be used in many applications, including consumer electronics, automotive electronics, and telecommunications. It can also be used for cooling of many industrial components, such as motors and controllers. This heat sink can also be used in industrial robotics, LED lighting, and medical electronics.
The HSF-48-30-Y-F works by drawing heat away from the component it is cooling. The heat sink is designed to absorb the heat, and draw it away from the component. The heat sink dissipates this heat into its fins, which helps to spread the heat evenly over the surface of the heat sink. The fins then radiate the heat into the surrounding environment, keeping the component cool. The unique V-shaped design of the fins helps to increase the surface area, which increases the amount of heat that can be dissipated. The HSF-48-30-Y-F is also designed to allow for easy installation. It is lightweight and can be easily mounted onto many different surfaces.
The HSF-48-30-Y-F is an ideal solution for many of today’s thermal management challenges. Its unique design allows for efficient cooling, while its small size makes it the perfect choice for applications where space is limited. The HSF-48-30-Y-F is a reliable and cost-effective solution for thermal management, making it the perfect choice for many applications.
The specific data is subject to PDF, and the above content is for reference