Allicdata Part #: | 345-1612-ND |
Manufacturer Part#: |
HSF-48-35-Y-F |
Price: | $ 24.61 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | FANSINK 5VDC 47.5X47.5X34.5MM |
More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
DataSheet: | HSF-48-35-Y-F Datasheet/PDF |
Quantity: | 50 |
1 +: | $ 22.14450 |
10 +: | $ 20.84040 |
25 +: | $ 19.53760 |
50 +: | $ 18.23510 |
100 +: | $ 17.58380 |
250 +: | $ 16.60690 |
Series: | HSF |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip |
Shape: | Square, Fins |
Length: | 1.870" (47.50mm) |
Width: | 1.870" (47.50mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.358" (34.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 0.77°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sinks are an important component of any electronic device. Heat sinks are used to dissipate the heat generated by electronic components and maintain their proper working temperature range. The HSF-48-35-Y-F is one of the most commonly used heat sinks and is used for various applications.
Application Field
The HSF-48-35-Y-F heat sink is primarily used in applications where lightweight and high-performance thermal solutions are required. This type of heat sink is popularly used in laptop computers, cell phones, DSL modems and other electronic equipment. It features an efficient fin layout for optimal heat dissipation and is constructed from aluminum alloy for durability and strength. It also has a threaded design that allows for easy installation and replacement.
The HSF-48-35-Y-F heat sink is also often used in high-performance active cooling applications for CPUs and GPUs. It has a large fin area and an effective fin shape that allows for maximum heat dissipation. The heat sink is equipped with mounting brackets for easy mounting, and it is also compatible with most current CPU and GPU models.
Working Principle
The HSF-48-35-Y-F heat sink works on the same principle as any other heat sink. It is designed with a metal alloy base and an array of fins attached to it. The material of the fins is usually made of aluminum, which is a good conductor of heat and allows it to spread evenly. Heat from the electronic component or processor is absorbed by the heat sink and then dissipated away from the component.
The HSF-48-35-Y-F heat sink has a fan attached to it. The fan accelerates the process of heat transfer by forcing air over the fins of the heat sink. This helps the heat sink to dissipate the heat from the processor much faster than if the fins were not present. The fan also helps to ensure that the heat dissipates away from the component so that the component can operate at optimal levels.
The HSF-48-35-Y-F heat sink is an efficient and reliable way to keep electronic components cool. It is lightweight, durable, and effective at dissipating heat. It is also relatively easy to install, making it a popular choice for many applications.
The specific data is subject to PDF, and the above content is for reference