HSF-48-40-B-F

Series:	HSF
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Clip
Shape:	Square, Fins
Length:	1.870" (47.50mm)
Width:	1.870" (47.50mm)
Diameter:	--
Height Off Base (Height of Fin):	1.358" (34.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	0.72°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Introduction to HSF-48-40-B-FHeat sinks have been around since antiquity, but the concept of thermal management has recently become a necessity in many industries. HSF-48-40-B-F is an advanced thermal management system invented by HSF Technologies that sets it apart from others on the market. The HSF-48-40-B-F is a type of copper extruded profile heat sink designed for use in high-power industrial applications where maximum cooling is required. This product consists of a thermal extruded aluminum profile designed to maximize thermal flux, moving heat away from the source and dissipating it into ambient air via a stack of extruded aluminum fins. What sets the HSF-48-40-B-F apart is its impressive combination of features. It is designed for high-heat applications, but utilizes a highly efficient thermal management system to reduce operating costs and extend product life. The unique design allows for the use of a large number of heat-dissipating fins which maximize thermal transfer and accomodate large component packages. The heat sink is constructed of a high-grade aluminum alloy which provides excellent thermal conductivity and corrosion resistance. The HSF-48-40-B-F is also designed to provide maximum cooling while minimizing size and weight. It is designed for easy assembly and installation, and it can be customized to meet each customer\'s individual needs. The HSF-48-40-B-F is also compatible with multiple mounting solutions, including screws, springs, and clips.Application Field and Working PrincipleThe HSF-48-40-B-F is a great solution for industrial applications that generate large amounts of heat. This includes applications such as laser heating, fuel cells, welding, semiconductor manufacture, and other high-heat industrial processes. Heat sinks are also commonly used to cool computers and other electronic devices, such as television sets and game consoles.The HSF-48-40-B-F functions by transferring its heat from the source to the fins, which are then exposed to the ambient air. As the fins come into contact with the air, they absorb its heat and the aluminum alloy transfers the thermal energy throughout the heat sink, allowing the process to continue until the temperature reaches equilibrium. The size of the fins and the design of the aluminum profile helps to optimize the thermal transfer while minimizing size and weight.ConclusionThe HSF-48-40-B-F heat sink is a great solution for high-heat applications which generate large amounts of heat. It is designed to provide maximum cooling while minimizing size and weight. Its unique design features, including the thermal conductive aluminum profile, allow it to effectively transfer and dissipate heat away from the source. The HSF-48-40-B-F is also compatible with multiple mounting solutions, making it a great choice for industrial and electronic applications which require maximum cooling.

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