| Allicdata Part #: | 345-1619-ND |
| Manufacturer Part#: |
HSF-50-25-B-F |
| Price: | $ 24.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 5VDC 50X50X24.5MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-50-25-B-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 21.69720 |
| 10 +: | $ 20.42270 |
| 25 +: | $ 19.14620 |
| 50 +: | $ 17.86980 |
| 100 +: | $ 17.23160 |
| 250 +: | $ 16.27440 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.846" (21.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.91°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-heat sinks are typically made of aluminum metal and are used to move heat away from sensitive electronic and mechanical components that require cooling. With the rapid advances in electronic and mechanical devices, the need for thermal management has become even more critical. Fortunately, HSF-50-25-B-F is a type of thermal-heat sink developed to meet the ever-growing demands for efficient cooling. This article will discuss the application field and working principle of the HSF-50-25-B-F thermal-heat sink.
The HSF-50-25-B-F thermal-heat sink has a wide range of applications in places such as computers, amplifiers, medical equipment, automotive, telecommunications, consumer electronics, and various industrial components. It is designed for efficient cooling of highly sensitive electronic and mechanical components. The HSF-50-25-B-F thermal-heat sink is able to dissipate a large amount of heat efficiently with its integrated copper fins, making it ideal for demanding applications that require both high cooling capability as well as reliable operation.
The working principle of the HSF-50-25-B-F thermal-heat sink is simple. The heat generated by the electronic or mechanical component is conducted to the fins of the heat sink. The fins increase the surface area of the heat sink, which allows heat to dissipate more quickly. The fins also absorb the heat, helping to reduce the ambient temperature. The heat is then dissipated to the surroundings with natural or forced airflow. The greater the airflow, the more heat can be removed from the device.
The HSF-50-25-B-F thermal-heat sink also features a built-in cooling fan that further enhances cooling performance. The fan circulates air through the heat sink, which helps to reduce the temperature of the fins and the surrounding area. This fan is highly effective at cooling the device, and can help reduce the operating temperature of the device and improve its performance.
The HSF-50-25-B-F thermal-heat sink provides an efficient cooling solution for high performance electronics and mechanical components. It is designed to be highly efficient and reliable, and is suitable for a variety of applications. It helps to reduce the operating temperature of the device, allowing it to work more reliably and with greater efficiency. In addition, its built-in cooling fan further enhances its performance, making it an ideal choice for demanding applications.
The specific data is subject to PDF, and the above content is for reference