| Allicdata Part #: | 345-1620-ND |
| Manufacturer Part#: |
HSF-50-25-Y-F |
| Price: | $ 24.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 5VDC 50X50X24.5MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-50-25-Y-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 21.69720 |
| 10 +: | $ 20.42270 |
| 25 +: | $ 19.14620 |
| 50 +: | $ 17.86980 |
| 100 +: | $ 17.23160 |
| 250 +: | $ 16.27440 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.91°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has become increasingly important in many field applications, and each application can have different requirements. Heat sinks are one of the most important components used to ensure that heat can be removed from the system efficiently. HSF-50-25-Y-F is a special series of heat sinks designed to meet different requirements of different applications.
HSF-50-25-Y-F is a type of heat sink which uses a combination of materials. It consists of a combination of aluminum plates and copper fins. The copper fins help to increase the surface area, which helps to increase the heat dissipation area. The aluminum plates help to provide a base with good thermal conductivity. The combination of these two materials gives this particular heat sink excellent performance.
HSF-50-25-Y-F is designed to be easy to install and easy to use. It uses a special mounting system which allows it to be mounted directly to the surface, eliminating the need for additional components or tools. Its simple design makes it easy to maintain, and its relatively low price makes it an attractive choice for many applications.
The application fields of HSF-50-25-Y-F can be used in a range of different applications, from computers to consumer electronics. It is especially suited for applications where the heat generated needs to be dissipated quickly, such as in cloud computing. In addition, it can be used in automotive and aerospace applications, since it has the ability to withstand high temperatures and also dissipate heat quickly.
The working principle of HSF-50-25-Y-F is based on the heat conduction principle. Heat is conducted from the components to the heat sink. The heat sink has a large surface area which helps it to transport the heat away from the components quickly. The heat is then dispersed into the air, which is why HSF-50-25-Y-F is an excellent choice for cooling applications.
HSF-50-25-Y-F is a versatile and reliable heat sink which can be used in a range of applications. Its combination of materials, design and working principle make it an ideal choice for cooling and dissipating heat. Its simple installation and maintenance make it an attractive choice for many applications. As more applications arise that need efficient cooling, HSF-50-25-Y-F is likely to become an increasingly popular choice.
The specific data is subject to PDF, and the above content is for reference