HSF-50-28-B-F Allicdata Electronics
Allicdata Part #:

345-1621-ND

Manufacturer Part#:

HSF-50-28-B-F

Price: $ 24.36
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: FANSINK 5VDC 50X50X27.5MM
More Detail: Heat Sink BGA Aluminum Alloy Top Mount
DataSheet: HSF-50-28-B-F datasheetHSF-50-28-B-F Datasheet/PDF
Quantity: 50
1 +: $ 21.92400
10 +: $ 20.63630
25 +: $ 19.34680
50 +: $ 18.05690
100 +: $ 17.41200
250 +: $ 16.44470
Stock 50Can Ship Immediately
$ 24.36
Specifications
Series: HSF
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.965" (24.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 0.82°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an incredibly important sub-discipline within engineering, as it allows for the monitoring and control of temperatures of both small components and large systems such as whole buildings and power plants. Thermally-aware devices, from tiny components to massive industrial systems, rely on thermal management solutions to maintain a safe operating temperature, and the HSF-50-28-B-F heat sink is one of the most advanced and efficient thermal management solutions on the market.

The HSF-50-28-B-F is a high-performance heat sink designed specifically for applications that require a highly efficient and reliable heat dissipation solution. It features a unique, highly efficient design that utilizes a combination of specially designed fins, pins, and heat pipes to maximize heat dissipation. The HSF-50-28-B-F features a lightweight, low-profile design that makes it ideal for applications that require high heat dissipation without the need for bulky components.

The HSF-50-28-B-F is designed for use in a variety of applications, ranging from LED lighting to high-performance computing. Its unique and efficient design make it suitable for applications that require low thermal resistance, such as LED lighting and high-power, high-temperature, and high-frequency applications. Additionally, the HSF-50-28-B-F is suitable for a variety of industrial applications, including industrial heaters, heating/air conditioning systems, electronic equipment, and military defense systems.

So how exactly does the HSF-50-28-B-F heat sink work? The HSF-50-28-B-F utilizes a unique combination of specially designed heat pipes, fins, and pins to maximize heat dissipation. By utilizing a combination of these features, the HSF-50-28-B-F is able to create a highly efficient heat dissipation solution, as the heat pipes are able to rapidly dissipate heat from the component without the need for a bulky heat sink component. The fins and pins provide further heat dissipation, further increasing the efficiency of the HSF-50-28-B-F.

In addition to its superior thermal performance, the HSF-50-28-B-F also features an extremely lightweight design, making it ideal for applications that require a light and low profile heat sink. Additionally, the design of the HSF-50-28-B-F allows for easy installation and mounting, as the heat sink can easily be screwed and mounted to a variety of surfaces.

The HSF-50-28-B-F is an incredibly innovative and efficient heat sink designed specifically for applications that require reliable thermal management and excellent heat dissipation capabilities. Its lightweight and low-profile design make it perfect for a variety of applications, including LED lighting, high-power electronics, and even industrial air heating/cooling systems, ensuring that it can be used in a variety of different applications.

Overall, the HSF-50-28-B-F is an incredibly advanced and efficient thermal management solution that can be used in a variety of applications that require reliable and efficient heat dissipation. Its highly efficient design and lightweight construction make it ideal for a variety of applications, from LED lighting to high-power electronics and even industrial heating/cooling systems.

The specific data is subject to PDF, and the above content is for reference

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