| Allicdata Part #: | 345-1622-ND |
| Manufacturer Part#: |
HSF-50-28-Y-F |
| Price: | $ 24.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 5VDC 50X50X27.5MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-50-28-Y-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 21.92400 |
| 10 +: | $ 20.63630 |
| 25 +: | $ 19.34680 |
| 50 +: | $ 18.05690 |
| 100 +: | $ 17.41200 |
| 250 +: | $ 16.44470 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.083" (27.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.82°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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Thermal and heat sinks are designed to transfer heat away from high-powered electronic components or other objects, and often, they are a crucial aspect of a complex engineering system. The HSF-50-28-Y-F is an example of one such thermal and heat sink, and it has a variety of applications and different working principles.
Description
The HSF-50-28-Y-F is an aluminum heat sink for convective cooling. It is made of a die-cast aluminum core that provides high heat dissipation capabilities, and comes with an anodized finish. The HSF-50-28-Y-F is also very lightweight, making it easier to install and more durable. It also has a smooth surface and fins for better air flow.
Application Field
The HSF-50-28-Y-F is a versatile aluminum heat sink that can be used for a variety of different applications. It is used widely in the automotive and electronic industries, and it has been specifically designed for use in a wide range of products such as telecommunications systems, power supplies, computer systems, refrigerator systems and LED lights.
Because of its high thermal dissipation capabilities, the HSF-50-28-Y-F can be used to keep electronics components cool during operation and its lightweight construction makes it suitable for use in a wide range of industrial applications. Many electronic components, such as processors, require a large amount of cooling in order to ensure their efficiency and longevity. The HSF-50-28-Y-F can be used to drive off the excess heat generated by these components to help prevent overheating.
Working Principle
The HSF-50-28-Y-F works by transferring heat away from hot spots in the system. Heat sinks are evolutionary in nature, meaning that thermal loss occurs from the heat source to the heat sink, and then from the heat sink to the surrounding air or environment. This thermal transfer process is known as convection cooling which works on the simple principle of moving air through the fins of a heat sink to transfer heat away from the device.
The HSF-50-28-Y-F also features an elongated fin design. This design allows for more contact between the heat source and the heat sink fins. This increases the effectiveness of heat transfer by creating a larger area for air to travel through and dissipate heat. In addition, the fin design allows for higher airflow velocity which further enhances convection cooling.
Conclusion
The HSF-50-28-Y-F is a versatile and high-quality aluminum heat sink designed for convective cooling. It is used widely in the automotive and electronics industries, and it is capable of transferring heat away from high-powered devices quickly and efficiently. This heat sink can be used to keep electronic components cool during operation and its lightweight construction makes it suitable for use in a wide range of industrial applications. Its elongated fin design also allows for better contact with the heat source, and higher airflow velocity for more effective heat transfer.
The specific data is subject to PDF, and the above content is for reference