HSF-50-30-B-F

Series:	HSF
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Clip
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.083" (27.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	0.77°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

A heat sink is a basic device that assists in the dissipation of thermal energy, usually from a motor\'s head and in cases of more efficient cooling, from an integrated circuit. The HSF-50-30-B-F is one such heat sink device which has many varied applications in the industry.The HSF-50-30-B-F is a high-performance heat sink and fan combined into one design. It is designed to provide efficient cooling while maintaining the necessary flow of air to the heat-sensitive components. The HSF-50-30-B-F features two 50mm fans, two 80mm fans and one 140mm fan and is suitable for mounting on a variety of processor cores.HSF-50-30-B-F is designed to provide reliable cooling to the processor even when it is under high load or when the environment temperature rises significantly. It is designed with a low profile aluminum heatsink and high quality bearings to ensure low noise and reliable cooling performance. It is also designed with a unique air shroud to prevent dust from entering and keep the air flow from being blocked. This allows for maximum cooling performance.The HSF-50-30-B-F is a great solution for cooling many types of hardware, so can be used in both desktop and laptop computers, gaming consoles, as well as other electronic devices. It is also a great choice for overclockers who need efficient cooling to keep their system running at the highest performance level.To ensure optimal cooling performance and longevity, the HSF-50-30-B-F has been designed to work in several applications. These include processor overclocking, continuous rendering and data analysis, as well as multi-GPU solutions. With its efficient cooling and low noise design, the HSF-50-30-B-F is a great choice for a wide range of thermal applications.As with any device, it is important to have the right cooling solution to ensure your device is running at the highest performance level. The HSF-50-30-B-F is designed to offer the best cooling possible while providing the necessary support for your device. Its efficient cooling performance and low noise design make it the perfect choice for a variety of applications.The working principle of the HSF-50-30-B-F is fairly simple. The two 50mm fans on the heatsink draw air, which helps to transfer the heat from the processor to the heatsink. The 80mm and 140mm fans then take over in cooling the heatsink itself. This helps to better dissipate the heat from the processor while taking advantage of the cooling power of the high-quality fans. The HSF-50-30-B-F is a great choice for anyone looking for an efficient cooling solution. With its low profile design, low noise output and reliable cooling performance, it is the ideal solution for any thermal application. Whether you need to cool an overclocked processor, or a laptop or gaming console, the HSF-50-30-B-F is sure to help keep your device running at the highest performance levels for a long time.

The specific data is subject to PDF, and the above content is for reference