| Allicdata Part #: | 345-1624-ND |
| Manufacturer Part#: |
HSF-50-30-Y-F |
| Price: | $ 24.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 5VDC 50X50X29.5MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-50-30-Y-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 22.14450 |
| 10 +: | $ 20.84040 |
| 25 +: | $ 19.53760 |
| 50 +: | $ 18.23510 |
| 100 +: | $ 17.58380 |
| 250 +: | $ 16.60690 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.161" (29.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.77°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a crucial component of the overall computing and electronics system. It is critical to ensure that the system operates within the specified temperature range for reliable operation. Heat sinks are designed to facilitate the removal of high levels of heat accumulation, such as during processor operations. A heat sink is a device that provides effective heat transfer from one component to another by increasing the area of contact between the two, and the HSF-50-30-Y-F heat sink is an example of this type of thermal management technology.
The HSF-50-30-Y-F is a two-component, actively-cooled heat sink. The first component is the base plate, which is made of aluminum and has a thickness of 0.06 inch (1.5 mm). This base plate provides support for the other components, as well as absorbing and dissipating heat from the processor. The second component of the HSF-50-30-Y-F is a fin stack made of aluminum. The fin stack is designed to provide a large surface area, which allows effective heat transfer to and from the processor. This reduces the amount of heat that is retained in the system and allows the processor to operate within its recommended temperature range.
The HSF-50-30-Y-F is designed for use with high-power processors and other components that generate high levels of heat. This type of heat sink is well suited for applications where performance and reliability are critical, as it is able to effectively dissipate heat from the system for prolonged periods of operation. The HSF-50-30-Y-F is most commonly used in computing and networking applications, such as server and data center operations, as well as in industrial and commercial applications.
The working principle of the HSF-50-30-Y-F is simple. Heat is generated within the system due to the operation of the various components. The heat is absorbed by the base plate of the heat sink and then transferred to the fin stack, which provides a large surface area for heat transfer. This increased surface area allows the heat to be more effectively dissipated to the ambient environment. This helps ensure that the system operates within the recommended temperature range for reliable operation.
The HSF-50-30-Y-F is an example of an effective thermal management solution for applications that require reliable cooling solutions. It is designed to provide effective heat transfer from the processor and other components to the ambient environment, which helps ensure that the system operates within its specified temperature range. The HSF-50-30-Y-F is a popular choice for use in computing and networking applications, as well as in industrial and commercial applications.
The specific data is subject to PDF, and the above content is for reference