| Allicdata Part #: | 345-1625-ND |
| Manufacturer Part#: |
HSF-50-35-B-F |
| Price: | $ 24.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 5VDC 50X50X34.5MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-50-35-B-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 22.37130 |
| 10 +: | $ 21.05400 |
| 25 +: | $ 19.73820 |
| 50 +: | $ 18.42220 |
| 100 +: | $ 17.76420 |
| 250 +: | $ 16.77730 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.161" (29.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.71°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management plays an important role in maintaining the performance and reliability of high-powered systems and electronic devices. Heat sinks are a key component in thermal management solutions, transferring heat from the device to the surrounding air, providing dissipation and cooling. HSF-50-35-B-F is a type of heat sink widely used in a variety of electronic applications.
Heat Sink Specifications
The HSF-50-35-B-F is a standard-sized heat sink constructed from aluminum with a black anodized finish. It is designed with two main L-shaped extrusions and has a base fins which are in contact with the heat generating component. In addition, the heat sink features fins that are soldered to improve the performance of the heat sink and increase the rate of heat transfer. The overall dimensions of the HSF-50-35-B-F are 50mm x 35mm x 35mm and its base is flat.
HSF-50-35-B-F Applications
The HSF-50-35-B-F heat sink is suitable for cooling a range of electronic components including amplifiers, power supplies, power converters and processor chips. It is also suitable for cooling other types of components and components that require a higher level of cooling. The HSF-50-35-B-F can be used in any system where there is a need for heat dissipation.
Heat Sink Working Principle
The HSF-50-35-B-F heat sink works on a simple yet effective principle. Heat is generated within an electronic component and then transferred to the heat sink’s fins through the base and fins. As air passes through the fins, the heat is expelled and dissipated into the atmosphere. The heat sink is designed to extract and dissipate heat from within the system, and thereby maintain a stable system temperature and ensure a thermally efficient environment.
Conclusion
The HSF-50-35-B-F is a widely used and efficient heat sink that can be used in a variety of applications. It is designed with two main L-shaped extrusions and fins that are soldered to improve the performance of the heat sink and increase the rate of heat transfer. The heat sink is designed to extract and dissipate heat from within the system, and thereby maintain a stable system temperature and ensure a thermally efficient environment.
The specific data is subject to PDF, and the above content is for reference