Allicdata Part #: | 345-1626-ND |
Manufacturer Part#: |
HSF-50-35-Y-F |
Price: | $ 24.86 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | FANSINK 5VDC 50X50X34.5MM |
More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
DataSheet: | HSF-50-35-Y-F Datasheet/PDF |
Quantity: | 50 |
1 +: | $ 22.37130 |
10 +: | $ 21.05400 |
25 +: | $ 19.73820 |
50 +: | $ 18.42220 |
100 +: | $ 17.76420 |
250 +: | $ 16.77730 |
Specifications
Series: | HSF |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip |
Shape: | Square, Fins |
Length: | 1.969" (50.00mm) |
Width: | 1.969" (50.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.358" (34.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 0.71°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat Sinks are essential components for dissipating energy generated by electronic components like transistors, logic gates, integrated circuits, and processors. The HSF-50-35-Y-F is a type of heat sink that is designed to be used in high-end consumer applications. This heat sink is equipped with a three-finned, rectangular design. The fins are designed to provide maximum cooling efficiency as they dissipate heat away from the device. The heat sink is made from a high-performance aluminum alloy that is lightweight yet strong and resistant to corrosion. The HSF-50-35-Y-F also comes with a mounting bracket for easy installation.
The design of the HSF-50-35-Y-F heat sink is optimized to provide maximum heat dissipation. The fins are configured in a rectangular shape, which allows them to capture more air flow. This improves the efficiency of the cooling system, as more heat is able to be dissipated quickly. The fins are also designed to reduce air turbulence and noise. The aluminum alloy construction of the heat sink also provides additional structural strength and durability.
Once the HSF-50-35-Y-F is installed, it will essentially work as an intermediary between the device and the ambient temperature. It will absorb heat from the device, dissipate it into the environment, and keep the internal temperature of the device low. As the device heats up, the heat sink will dissipate it away from the device, allowing for more efficient thermal management.
The HSF-50-35-Y-F is an effective heat sink for many high-end consumer applications. It is designed to provide maximum performance and is capable of dissipating heat quickly and efficiently. Its aluminum alloy construction provides additional structural strength and corrosion resistance, while its fin configuration helps to reduce turbulence and noise. Additionally, the HSF-50-35-Y-F is easy to install and is relatively low-cost.
In conclusion, the HSF-50-35-Y-F is an effective and reliable heat sink for high-end consumer applications. Its fin configuration and aluminum alloy construction provide efficient heat dissipation and improved durability. Additionally, its mounting bracket makes it easy to install in any system. Therefore, it is a great option for those looking for a reliable and effective heat sink for their consumer applications.
The specific data is subject to PDF, and the above content is for reference
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