HSF-50-40-Y-F

Series:	HSF
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Clip
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.555" (39.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	0.67°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Thermal - Heat Sinks

Heat sinks are essential components in the majority of electronic applications, like computers, consumer electronics, and industrial machinery, due to their ability to dissipate heat quickly and safely. Generally speaking, heat sinks are made from metallic plates, such as aluminum or copper, that contain several small fins or pins. These fins and pins create an increased amount of surface area for heat to be released into the environment. The HSF-50-40-Y-F is a specialized heat sink designed to meet the demands of high-powered, high-efficiency systems.

HSF-50-40-Y-F Application Field

The HSF-50-40-Y-F heat sink is designed and manufactured to handle the large temperature spikes associated with high-powered devices, such as processors, video cards, and graphics cards. The HSF-50-40-Y-F boasts a fin area that is five times larger than conventional heat sinks, allowing it to dissipate up to 40 watts of heat simultaneously. The HSF-50-40-Y-F is well suited for medium to large sized system cabinets, providing an optimal cooling solution for a variety of applications.

HSF-50-40-Y-F Working Principle

The HSF-50-40-Y-F is specifically designed to dissipate heat quickly and efficiently, while remaining smaller and lighter than other heat sinks. Its primary function is to absorb heat dependent upon the surrounding temperature and atmospheric conditions. The HSF-50-40-Y-F utilizes a unique fin design that spreads both the direct heat coming from the processor, as well as the indirect heat coming from the surrounding components. This allows the heat to be dissipated quickly across the entire surface area of the fin, which is five times larger than other heat sinks. The HSF-50-40-Y-F also comes with a copper base plate, which is specifically designed to conduct heat away from the source quickly. This copper base plate also improves the thermal performance of the HSF-50-40-Y-F as compared to other heat sinks without a copper base. The HSF-50-40-Y-F is the ultimate choice for dissipating extreme amounts of heat in many high-powered, high-efficiency systems. By combining a large fin area with a copper base, the HSF-50-40-Y-F is able to provide the highest levels of thermal performance and dissipation in an extremely compact size.

Conclusion

The HSF-50-40-Y-F is an ideal choice for high-powered applications where efficient heat dissipation is critical. The large fin area allows for up to 40 watts of heat to be dissipated, while the copper base plate quickly and effectively conducts heat away from the source. Together, these two components create an efficient system of thermal management that is unsurpassed in the industry. No matter the application, the HSF-50-40-Y-F is sure to provide an optimal cooling solution.

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