| Allicdata Part #: | 345-1629-ND |
| Manufacturer Part#: |
HSF-55-24-B-F |
| Price: | $ 24.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 12VDC 55X55X24.1MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-55-24-B-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 21.69720 |
| 10 +: | $ 20.42270 |
| 25 +: | $ 19.14620 |
| 50 +: | $ 17.86980 |
| 100 +: | $ 17.23160 |
| 250 +: | $ 16.27440 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 2.165" (55.00mm) |
| Width: | 2.165" (55.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.555" (39.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 1.00°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks is a piece of equipment that is essential for manufacturers in various industries to keep their products running efficiently and accurately. The HSF-55-24-B-F is an excellent example of a heat sink that provides superior cooling performance and efficiency.
An HSF-55-24-B-F is a high-quality, two-stage, fan-cooled heat sink constructed of aluminum. The geometry of the fins provides excellent cooling capacity and allows for better air flow. The fan provides additional cooling when required. It is perfectly suitable for a wide range of applications such as power electronics, power supplies, power amplifiers, motor controllers, and industrial PCs.
The HSF-55-24-B-F has a highly efficient thermal design. It features an embedded copper base and a fin structure which minimizes interference with the airflow and maximizes the surface area. In comparison to alternative cooling solutions, the HSF-55-24-B-F offers on average 30% more cooling, while providing a 30% lower fan power consumption. This means that the HSF-55-24-B-F can handle higher temperatures and can run more efficiently than other cooling solutions. In addition, the fan is silent and vibration-free, ensuring a quiet and reliable operation.
The HSF-55-24-B-F has various applications that largely depend on the user’s specific requirements. The heat sink can be used to dissipate heat from any device with efficient heat transfer from the heat-generating component to the mounting surface. It can also be used to cool down systems with high ambient temperatures in order to protect the component from potential damage.
When it comes to the working principle of the HSF-55-24-B-F, it follows the standard principles of heat transfer. Heat is transferred from the heat source to the cooling fins of the heat sink, where it is dispersed into the atmosphere. The fan then helps to disperse the circulated warm air, which in turn helps to cool the heat source. This circulation of air helps to dissipate the heat efficiently and quickly, ensuring that the heat source remains at a low temperature.
In conclusion, the HSF-55-24-B-F is an excellent thermal solution with superior cooling performance. Its efficient design provides exceptional cooling performance while consuming less energy, making it an ideal choice for manufacturers who need reliable cooling solutions. Its wide range of applications and quiet operation make it a perfect fit for a variety of industries.
The specific data is subject to PDF, and the above content is for reference