Allicdata Part #: | 345-1630-ND |
Manufacturer Part#: |
HSF-55-24-Y-F |
Price: | $ 24.11 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | FANSINK 12VDC 55X55X24.1MM |
More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
DataSheet: | HSF-55-24-Y-F Datasheet/PDF |
Quantity: | 50 |
1 +: | $ 21.69720 |
10 +: | $ 20.42270 |
25 +: | $ 19.14620 |
50 +: | $ 17.86980 |
100 +: | $ 17.23160 |
250 +: | $ 16.27440 |
Series: | HSF |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip |
Shape: | Square, Fins |
Length: | 2.165" (55.00mm) |
Width: | 2.165" (55.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.949" (24.10mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 1.00°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are designed to transfer heat from one area to another. These devices work by allowing heat to be dissipated from the hottest point to a cooler point, either through air or a substance such as liquid or solid. The HSF-55-24-Y-F is a very common Heat Sink used in many applications, and has a wide range of applications and working principles.
The HSF-55-24-Y-F is made from extruded aluminum fin profiles, which are designed with integrated cooling fins that improve heat dissipation. These fins can also reduce the overall weight of the unit, making it easier to install in tight spaces. The thermal resistance of the HSF-55-24-Y-F is also low, allowing it to dissipate more heat than other heat sinks.
The HSF-55-24-Y-F is commonly found in electrical and electronics equipment. It is used to dissipate heat from the components in an electronic device, allowing the unit to operate more efficiently and over a longer period of time. The HSF-55-24-Y-F also helps to protect the components from damage caused by extreme temperatures, thus prolonging the life of the unit.
The HSF-55-24-Y-F also has a wide range of applications in medical and industrial processes. For example, it can be used to cool industrial machinery, such as air compressors and oil coolers. In the medical field, it is used to cool MRI machines and other medical equipment. In addition, the HSF-55-24-Y-F is used in automotive applications to dissipate the heat produced by the engine.
The HSF-55-24-Y-F typically operates on a principle of forced air convection. In this type of system, the device uses a series of fins that direct the airflow in a specific direction. This causes the air to move over the fins, thus cooling them. Air is constantly pushed over the fins as long as the unit is powered on, allowing it to maintain an ideal operating temperature.
The HSF-55-24-Y-F is a highly effective and efficient heat sink that can be used in various applications. It improves the performance of electronic and industrial components by dissipating heat quickly, and can protect the components from damage caused by high temperatures. The device is also easy to install, making it an ideal choice for tight spaces and high-traffic areas.
The specific data is subject to PDF, and the above content is for reference