| Allicdata Part #: | 345-1631-ND |
| Manufacturer Part#: |
HSF-55-27-B-F |
| Price: | $ 24.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 12VDC 55X55X27.1MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-55-27-B-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 21.92400 |
| 10 +: | $ 20.63630 |
| 25 +: | $ 19.34680 |
| 50 +: | $ 18.05690 |
| 100 +: | $ 17.41200 |
| 250 +: | $ 16.44470 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 2.165" (55.00mm) |
| Width: | 2.165" (55.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.949" (24.10mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.81°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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Thermal management is an important aspect for many pieces of equipment that generate heat. This is especially true for electronics, where overheating often leads to system malfunctions, reduced performance, and sometimes complete failure. One of the key components used in thermal management systems are heat sinks. HSF-55-27-B-F is a specific series of heat sinks designed to be used in a variety of applications.
HSF-55-27-B-F heat sinks are designed to transfer heat away from important components and dissipate it into the surrounding air. The heat sinks are made of a variety of materials designed to be as efficient at heat dissipation as possible, while also being lightweight. Commonly used materials for HSF-55-27-B-F heat sinks include aluminum, copper, and other metal alloys. All heat sinks in the series also feature fins and other heat transfer features designed to help dissipate heat more efficiently.
HSF-55-27-B-F heat sinks are usually used in a wide variety of applications. Some common uses include cooling down electronics components in CPUs, GPUs, power supplies, and other computer components. They can also be used to cool down motorized devices, such as electric motors, that generate heat as a byproduct of their operation. HSF-55-27-B-F heat sinks are also commonly used in industrial and commercial settings to help regulate temperature in equipment rooms, warehouses, and other high heat areas.
The working principle behind HSF-55-27-B-F heat sinks is relatively simple. When heat is generated by an electronic component, such as a CPU, the heat is transferred to the heat sink. The heat is then dissipated into the surrounding air, typically through convection. The heat sink absorbs the heat and transfers it away from the component, helping to reduce its temperature and keep the system functioning properly.
The HSF-55-27-B-F series of heat sinks offers a wide variety of solutions for cooling electronic components and dissipating heat. They are designed to be durable, lightweight, and efficient at transferring and dissipating heat. Other important factors, such as noise levels and air flow, are also taken into consideration. With its wide range of applications and features, the HSF-55-27-B-F series of heat sinks offers a solution for a variety of thermal management needs.
The specific data is subject to PDF, and the above content is for reference