| Allicdata Part #: | 345-1632-ND |
| Manufacturer Part#: |
HSF-55-27-Y-F |
| Price: | $ 24.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 12VDC 55X55X27.1MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-55-27-Y-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 21.92400 |
| 10 +: | $ 20.63630 |
| 25 +: | $ 19.34680 |
| 50 +: | $ 18.05690 |
| 100 +: | $ 17.41200 |
| 250 +: | $ 16.44470 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 2.165" (55.00mm) |
| Width: | 2.165" (55.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.067" (27.10mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.81°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is the cornerstone of efficient operation of any electronic or electrical device. Heat sinks are a physical component used to ensure that excess heat generated by the device does not build up and cause electrical failures. Heat sinks are used in many consumer and industrial applications.
The HSF-55-27-Y-F is a high performance thermal heat sink used in multiple heat management applications. It is designed to dissipate heat quickly and efficiently without producing any additional noise. From cooling semiconductor devices to consumer electronics, this heat sink offers reliable and high performance cooling capabilities for a broad-range of uses.
The HSF-55-27-Y-F heat sink generally consists of a large base designed to dissipate heat away from a component or device, a series of cooling fins that increase the surface area for increased heat dissipation, and a snap-on fan that helps circulate air around the device or component. The entire assembly is typically mounted onto a PC board or component to provide a secure and reliable connection.
In order to achieve optimum thermal management, it is important to consider the environment in which the heat sink is used. The HSF-55-27-Y-F is designed to withstand high temperatures and varying humidity levels. Additionally, as this type of heat sink is designed for easy installation, the user can be sure of a secure fit, even in tight spaces.
The HSF-55-27-Y-F heat sink is able to dissipate excess heat in a couple of different ways. Firstly, when the assembly is mounted onto the component or device, it creates a conventional thermal path which dissipates the majority of the generated heat through direct contact with the base of the heat sink. Secondly, the snap-on fan circulates air around the assembly, resulting in increased air flow and improved heat dissipation.
The HSF-55-27-Y-F is an ideal heat sink to be used in a variety of applications. It can be used to cool semiconductor and electronics devices, as well as for cooling of lighting fixtures and telecom equipment. Additionally, the heat sink can be used in automotive applications, such as to cool engine emissions control systems and to prevent overheating of vehicle electronics.
HSF-55-27-Y-F heat sinks provide efficient thermal management in a variety of settings. The assembly is designed to be durable and to provide superior heat dissipation with minimal noise production. In order to ensure optimal performance, it is important to consider the environment in which the heat sink is used and to select the right individual components for the installation.
The specific data is subject to PDF, and the above content is for reference