| Allicdata Part #: | 345-1633-ND |
| Manufacturer Part#: |
HSF-55-30-B-F |
| Price: | $ 24.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 12VDC 55X55X30.1MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-55-30-B-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 22.14450 |
| 10 +: | $ 20.84040 |
| 25 +: | $ 19.53760 |
| 50 +: | $ 18.23510 |
| 100 +: | $ 17.58380 |
| 250 +: | $ 16.60690 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 2.165" (55.00mm) |
| Width: | 2.165" (55.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.067" (27.10mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.70°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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Thermal management is an essential part of all electronic products. Heat sinks are a device that absorbs thermal energy from an electronic component or device and dissipates it into the atmosphere. A HSF-55-30-B-F is an example of a heat sink designed to provide efficient cooling solutions for many types of electronic components and devices.
HSF-55-30-B-F has a compact two-piece construction. It is made of high-quality aluminum alloy and has excellent thermal conductivity, which makes it highly efficient at dissipating heat. The heat sink is designed with a unique convex fin design that increases its thermal efficiency by providing larger surface area for heat to dissipate. It also features a unique "no-push" clip design, which eliminates the need for a push pin or other mounting systems. This makes installation and removal easy.
The HSF-55-30-B-F is designed to provide efficient cooling solutions for a wide variety of electronic components and devices, including CPUs, GPU, SDRAM, and MCUs. It is suitable for both air and liquid cooled systems due to its high thermal conductivity. It is also compatible with most existing cooling systems and is compatible with most standard mounting systems.
The HSF-55-30-B-F is designed to work using two main principles: airflow and heat conduction. Its convex fin design increases airflow around the heat sink, allowing heat to be dissipated quickly. Its high thermal conductivity dissipates heat directly from the heat source to the atmosphere. Heat is dissipated by transferring the thermal energy from the device to the air using the fins. The fins can also increase the surface area of contact with the air, increasing the rate at which heat can be dissipated from the device.
The HSF-55-30-B-F is designed to provide efficient cooling for a wide range of electronic devices and components. Its two-piece construction and unique convex fin design make it versatile and efficient. Its no-push clip design simplifies installation while its compatibility with most cooling systems and mounting systems ensure that it can be used with most devices and components with ease. Its high thermal conductivity also makes it an excellent choice for dissipating heat from devices quickly and efficiently.
The specific data is subject to PDF, and the above content is for reference